Samsung Electro-Mechanics said Wednesday (November 5) it will form a joint venture with Sumitomo Chemical Group that will manufacture glass core, a key material for package substrates.

Accordingly, the joint venture company will aim to overcome the limitations of package substrate technology amid the rapid advancement of artificial intelligence (AI) and high-performance computing.

Through this agreement, Samsung Electro-Mechanics and Sumitomo Chemical, along with Dongwoo Fine-Chem, will leverage their respective technological strengths and global networks to establish manufacturing capabilities for the Glass Core and accelerate market expansion.

Propelling Essential Technology

Glass core is a core material for next-generation semiconductor package substrates. In fact, has become an essential technology for realizing high-density, large-area advanced semiconductor package substrates, thanks to its lower coefficient of thermal expansion and superior flatness compared to conventional organic substrates.

In the joint venture, Samsung Electro-Mechanics will serve as the primary investor with a majority stake. Othe other hand, Sumitomo Chemical Group will participate as a minority shareholder. The companies expect to sign the main agreement, which includes details such as structure and business schedule, by next year. The headquarters will be located at Dongwoo Fine-Chem’s Pyeongtaek site, which will also serve as the initial production base for ‘Glass Core’.

Samsung Electro-Mechanics is currently producing glass package substrate prototypes at its Sejong plant pilot line. Mass production is planned to begin with the joint venture after 2027.

The MOU signing ceremony was held at Tokyo, Japan and attended by Chang Duckhyun, President of Samsung Electro-Mechanics, Keiichi Iwata, Chairman of Sumitomo Chemical, Nobuaki Mito, President of Sumitomo Chemical, and Lee Jongchan, President of Dongwoo Fine-Chem (a subsidiary of Sumitomo Chemical), along with other key executives.

06 November 2025