VisionPower Semiconductor Manufacturing Company (VSMC) has officially opened its first 300mm semiconductor fabrication facility in Singapore, marking a significant milestone for the joint venture between Vanguard International Semiconductor Corporation (VIS) and NXP Semiconductors.

Located in Tampines, the new 12-inch wafer fab is expected to play a strategic role in strengthening global semiconductor supply chain resilience. Following the completion of construction, the facility has entered risk production and is scheduled to begin volume manufacturing in the first quarter of 2027.

The opening ceremony attracted senior government leaders, industry stakeholders, customers, suppliers, and technology partners, underscoring the project’s importance to Singapore’s growing semiconductor ecosystem and the global chip industry.

Advanced Manufacturing Hub Positioned for Long-Term Growth

Established in September 2024, VSMC moved rapidly from groundbreaking to production readiness. After 22 months of construction, the facility processed its first sample lot and achieved yields exceeding 99%, keeping the project on track for commercial production.

The fab will manufacture specialty semiconductor products using process technologies ranging from 130nm to 40nm. These technologies will support mixed-signal, power management, analog, and interposer applications that serve a diverse range of markets, including high-performance computing, mobile devices, automotive systems, industrial applications, and consumer electronics.

By 2029, the facility is expected to reach a production capacity of approximately 44,000 12-inch wafers per month. The project is also projected to create around 1,600 jobs, contributing to talent development and economic growth in Singapore.

Smart Fab Strategy Enhances Efficiency and Customer Support

A key differentiator of the facility is its fully automated smart manufacturing model. VSMC has integrated artificial intelligence and digital management technologies throughout operations to improve manufacturing efficiency and enhance customer service capabilities.

According to Leuh Fang, Chairman of VSMC and VIS, the facility represents an important step in expanding the company’s international manufacturing footprint.

“Today’s opening ceremony marks a significant milestone for VSMC and reflects VIS’ long-term commitment to deepening its presence in Singapore while expanding its global footprint.”

He added: “With the fab now officially operational, we will be better positioned to meet our customers’ growing demand for specialty IC manufacturing, further strengthen the resilience of the global semiconductor supply chain, and contribute to the continued growth of Singapore’s high-tech industry and semiconductor ecosystem.”

NXP Sees Greater Manufacturing Resilience

For NXP Semiconductors, the fab forms part of a broader manufacturing strategy aimed at ensuring long-term supply assurance and operational flexibility.

Rafael Sotomayor, President and Chief Executive Officer of NXP, emphasized the strategic value of the investment.

“The VSMC joint venture fab marks an important milestone in further strengthening NXP’s manufacturing base and assurance to support long-term customer demand.”

He added that the facility enhances geographic resilience, supply control, and cost competitiveness while supporting the company’s hybrid manufacturing strategy and next-generation intelligent edge and Physical AI technologies.

Sustainability and Talent Development Remain Core Priorities

Beyond production capacity expansion, VSMC has embedded environmental sustainability into the project’s design and operations. The facility was designed and constructed according to LEED and Singapore Green Mark standards, incorporating renewable energy solutions, water recycling initiatives, and energy-efficiency measures.

Singapore’s Economic Development Board highlighted the broader economic impact of the investment. Cindy Koh, Executive Vice President of EDB, noted that VSMC’s collaboration with educational institutions will help build a skilled semiconductor workforce while supporting advanced manufacturing innovation.

28 September 2026