Japanese advanced semiconductor manufacturer Rapidus has unveiled Rapidus Collaborative Open Rapid Ecosystem (CORE), a global ecosystem framework designed to support the development and mass production of next-generation semiconductors. The initiative marks a significant step in the company’s strategy to build a comprehensive environment that links research institutions, design specialists, electronic design automation (EDA) providers, intellectual property (IP) vendors, and manufacturing partners.

The announcement reflects a growing industry recognition that advanced semiconductor innovation can no longer rely solely on fabrication technology. Instead, chipmakers increasingly require highly integrated ecosystems that connect every stage of the semiconductor value chain and provide customers with reliable development and manufacturing infrastructure.

According to Rapidus, the company will actively promote the expansion of the CORE initiative as a platform for global collaboration across the semiconductor industry. The company stated that semiconductor development now requires “connecting the entire semiconductor value chain, including research institutions, EDA, IP, design and manufacturing, and providing customers with a reliable development and production foundation.”

First Phase Focuses on Design Ecosystem

As the first component of CORE, Rapidus introduced its Design Solution Associate network, a group of 17 design-related companies from across Asia, North America and other global markets.

The initiative addresses one of the industry’s most pressing challenges: the worldwide shortage of advanced semiconductor engineering talent. By leveraging the expertise and resources of specialized design partners, Rapidus aims to help customers begin development activities earlier and accelerate time-to-market for advanced chip projects.

The company emphasized that collaboration with domestic and international design firms is essential because “building a design ecosystem that enables customers to begin development early is important.”

Design Solution Associates will serve as a bridge between customers and Rapidus, providing technical expertise, engineering resources and design support throughout the chip development process.

Global Partner Network Expands Customer Options

The inaugural Design Solution Associate network includes 17 companies, among them Cadence Design Systems, Synopsys, HCLTech, Infosys, Wipro, Quest Global, MosChip Technologies, TOPPAN, Dai Nippon Printing and Toshiba Information Systems.

Rapidus said the network will strengthen support structures from design through manufacturing, enabling more customized solutions aligned with customer requirements.

Importantly, CORE is not expected to remain limited to design services. Rapidus plans to broaden the framework by adding additional categories, including EDA and IP partners. The company stated that it will “further enhance the global ecosystem supporting the development and mass production of advanced semiconductors” through expanded cooperation across those categories.

Strategic Industry Implications

The launch of CORE highlights the semiconductor industry’s growing shift toward ecosystem-driven innovation. As process technologies become increasingly complex, successful commercialization depends on seamless collaboration among design, software, IP and manufacturing stakeholders.

For global semiconductor customers, Rapidus is positioning CORE as a pathway to faster development cycles, broader access to specialized expertise and stronger end-to-end support for advanced chip programs.

06 October 2026