Siemens, UMC Collaboration Yields Proven Design Kits

Siemens Digital Industries Software and United Microelectronics Corporation (UMC) will collaborate on several innovative designs for ICs for automotive and power applications. Particularly, Siemens will develop process design kits for UMC’s 110nm and 180nm Bipolar-CMOS-DMOS (BCD) technology platforms.

Siemens build the custom IC design kits using its Tanner software. In addition, the foundry’s BCD platforms aim to provide best-in-class chip design kits and integrated product solutions for applications requirement PMICs, battery management ICs, and wireless and fast charging ICs.

Siemens has collaborated with United Microelectronics Corporation (UMC) to develop process design kits for the foundry‘s 110nm and 180nm BCD technology platforms (Photo by Siemens).

Delivers Power IC Designs

BCD technology delivers power IC designs of up to 100V operating voltage, enabling exceptional energy efficiency and high integration that combines analog circuits and digital content as well as power devices and embedded NVMs.

“Dozens of customers’ designs have been verified and entered production in the last few quarters amid robust market demand,” said Cedric Lee, Senior Division Director and Chairman of the High Voltage Product Line Management Committee at UMC. “With applications becoming more sophisticated, power management solutions are also getting increasingly complex.”

In addition, Lee said innovations such as Edge AI and mobility devices are driving the need for higher performance on shrinking area and low leakage. Moreover, he said the collaboration strives to equip customers with the tools need to bring their designs to life.

Siemens’ Tanner software features an advanced, high-performance, easy-to-use schematic and layout editor and integration with best-in-class circuit simulators and Calibre software. Specifically, the software is the industry-leading solution for design rule checking, parasitic extraction, and physical verification. Tanner has a 30-year track record in successfully taping out thousands of designs.

“Through our collaboration with UMC, our mutual customers can adopt the certified process design kit for BCD technologies and start designing immediately with increased productivity,” said Fred Sendig, General Manager of the Integrated Circuit Design Solutions group at Siemens Digital Industries Software. “These certified PDKs allow UMC customers to leverage the complete Siemens EDA custom IC design flow, enabling them to design innovative applications with confidence.”