Advantest Corporation released two new additions to its MPT3000 solid-state drive (SSD) test platform. Specifically, the Independent Thermal Control (ITC) device interface boards (DIBs) and Engineering Thermal Chamber (ETC) target early engineering adoption of the MPT3000. Accordingly, they enable efficient, small-batch engineering, quality assurance, and early test development for SSD devices.

Advanced computing standards, such as PCI Express fifth generation (PCIe Gen 5), enable higher-speed SSD devices with greatly expanded bandwidth for use in advanced data centers and other demanding storage applications. These faster, higher-capacity devices must undergo characterization and testing in thermal environments that accurately replicate operating temperatures.

The ETC suits device test qualification and validation. Specifically, it is integrated into the MPT3000ES3 test system to handle the highest-power PCIe Gen 5 DUTs. This unit enables accurate environmental temperature control within the chamber from -10 to 85°C. Also, it utilizes airflow to accurately condition up to 32 4-lane DUTs. The ETC is perfect for characterizing small batches of DUTs at a set temperature within the range stated.

Meanwhile, the MPT3000HVM3 test systems support ITC DIBs and created for high-volume production test and qualification. Specifically, they allow the user to accurately set and maintain a constant drive temperature.  Using active temperature feedback from the DUT, the fan speed is controlled to maintain a constant DUT temperature. This is an improvement from standard DIBs, which supply constant cooling air and allow the DUT temperature to fluctuate with the wattage of the test cycle.  ITC DIBs feature air channels on either side of the DUT. They maintain a constant DUT temperature on all DUTs, even during asynchronous testing cycles.

“Our customers increasingly need an easy-to-implement solution for engineering, quality assurance, and early test development on their SSD devices to ensure they will operate reliably, at temperature, in their end environments,” said Indira Joshi, VP of the MPT3000 product line. “With these new products for our proven MPT3000 test platform, users can execute all of these tasks efficiently, in small batches, for greater flexibility at test, qualification, and validation.”

Customer deliveries are currently underway for the Engineering Thermal Chamber and Independent Thermal Control device interface boards. The products will be available for customer purchase in Q4 calendar year 2023.