Socionext has announced a collaboration with Arm and TSMC for the development of an innovative power-optimized 32-core CPU chiplet. Particularly, in TSMCʼs 2nm silicon technology.

Accordingly, this will enable the company to deliver scalable performance for hyperscale data center server, 5/6G infrastructure, DPU, and edge-of-network markets. The engineering samples are likely to be available in 1H2025.

This advanced CPU chiplet proof-of-concept using Arm® Neoverse™ CSS technology suits for single or multiple instantiations within a single package. This goes along with IO and application-specific custom chiplets to optimize performance for a variety of end applications.

It can support multiple target applications because it leverages CPU chiplets and customized application-specific chiplets. When new chiplets become available, a cost-effective package-level upgrade path can be supported.

Advanced Packaging Technology

“Socionext is a leading provider of custom SoCs for global hyperscale data center, automotive, and networking customers. Driven by commercial and time-to-market benefits, there is a growing customer demand for granular compute power. Leveraging silicon re-use to create multiple product platforms enables innovative system architectures. With leading silicon node enablement and our partnership with Arm, we are designing and delivering highly integrated large scale silicon solutions to global customers,” said Hisato Yoshida, Corporate Executive Vice President and the Head of Global Development Group at Socionext.

In addition, Yoshida said, “This chiplet complements our customersʼ current SoC designs and provides system architects new degrees of freedom to deliver many platform variants for a product family.”

“Arm Neoverse CSS is unlocking greater accessibility to custom silicon and driving innovation across the chiplet ecosystem,” said Mohamed Awad, senior vice president and general manager, Infrastructure Line of Business, Arm. “The advanced chiplet proof-of-concept from Socionext is demonstrating what is possible through Arm Total Design and will accelerate the path to custom, workload-optimized solutions for our broader ecosystem.”

Meanwhile, Dr. Cliff Hou, Senior Vice President of Corporate Research/Research and Development at TSMC, said the company, through its 2nm technology, is happy to support Socionext and Arm’s flexible chiplet design. “We have worked with Socionext across many generations of our leading-edge technology, and look forward to extending this collaboration into the 2nm generation.”