Tokyo Electron (TEL) has expanded its line of sputtering systems with the release of LEXIA™-EX. Accordingly, LEXIA™-EX builds on TEL’s technologies developed for next-generation memory devices.
Thus, the new system enables high-performance, high-productivity sputter for a wide range of applications. This includes advanced logic, DRAM, and 3D NAND devices.

For more than a decade since the introduction of the EXIM™ sputtering system, with its unique and unprecedented product concept, TEL has made many significant contributions to the mass production of advanced semiconductor devices. Particularly, in the sputtering process for next-generation memory devices, TEL’s mass production equipment has earned a solid reputation. Therefore, it earned reputation as a world-leading product performance and finely tuned support services for high availability.

High Productivity, System Scalability

LEXIA™-EX inherits EXIM™’s unique ultra-high vacuum chamber design to deliver superior uniformity of film thickness, quality, and composition. On the other hand, it is offering high productivity and system scalability through multi-module support.

Maximum throughput is 100wph, 20% higher than its predecessor, while the footprint is about 40% smaller and CO2 emissions are 14% lower.

In addition to the existing four-cathode1 deposition chamber, a newly developed high-productivity dPVD2 (dual PVD) chamber with two ultra-large cathodes has been introduced to expand the range of chambers. The reinforcement enables highly efficient and uniform deposition of single layer films, including next-generation DRAM capacitor hard masks and functional films for advanced logic devices.

“LEXIA™-EX maintains the basic product concepts of its predecessor, including high productivity and system scalability, while achieving superior environmental performance and a significant reduction in footprint,” said Shigeki Nakatani, General Manager of TFF BU at TEL.

Furthermore, Nakatani said, “The system has been increasingly adopted for a wide range of applications in advanced logic and memory devices. In the future, we will continue to expand our product range to meet the needs of our customers.”

Notes

*1 Cathode: An electrode for material deposition
*2 PVD: Physical Vapor Deposition.
LEXIA and EXIM are registered trademarks or trademarks of Tokyo Electron Group in Japan and/or other countries.
09 December 2024