AEI

ASIA ELECTRONICS INDUSTRYYOUR WINDOW TO SMART MANUFACTURING

FPT to Set up New Advanced Chip Line in Vietnam

Vietnamese IT conglomerate FPT Corporation has established FPT Advanced Semiconductor Testing and Packaging plant in Hanoi as the company aims to strengthen Vietnam’s position in the global semiconductor supply chain.

Accordingly, the new facility is the first semiconductor testing and packaging plant in Vietnam fully owned and operated by Vietnamese companies. Therefore, contributing to the completion of the national semiconductor ecosystem with a full spectrum of activities spanning research, design, manufacturing, training, testing and packaging, and commercialization.

Officials of FPT Corporation, Viettel Corporation, and other government officials grace the announcement ceremony of the FPT Advanced Semiconductor Testing and Packaging plant.

Enabling “Make in Vietnam” Chips

The announcement of the establishment of the FPT Advanced Semiconductor Testing and Packaging Plant underscores FPT’s strong commitment to implement Vietnamese government’s target to have 10 advanced testing and packaging facilities by 2030.

Moreover, the initiative also represents a strategic move to harness the collective strength of the national semiconductor alliance. That is, jointly developing and mastering core technology capabilities, and completing an integrated semiconductor ecosystem spanning research, design, manufacturing, testing, packaging, and commercialization.

In addition, the plant will provide hands-on training and practical learning opportunities for semiconductor students within Vietnam. Therefore, contributing to the enhancement of human resource quality in the semiconductor sector and supporting the national goal of developing 50,000 semiconductor professionals by 2030.

Mr. Truong Gia Binh, Chairman of FPT Corporation, stated, “If Vietnam is to become a prosperous nation, there is no other path than mastering semiconductor technology…We will closely collaborate with Viettel and domestic partners—wherever chips are manufactured, FPT will participate in testing and packaging—so that Vietnamese technology chips can soon be applied in real life.”

Lieutenant General Tao Duc Thang, Member of the Party Central Committee, Chairman and CEO of Viettel said FPT’s investment in a semiconductor testing and packaging plant holds strategic significance in completing the ‘Make in Vietnam’ semiconductor ecosystem.

Region’s Leading Advanced Testing, Packaging Line

The FPT Advanced Semiconductor Testing and Packaging Plant is located at Yen Phong II-C Industrial Park, Yen Phong and Tam Giang Communes in Bac Ninh Province. It is expected to emerge as a leading advanced testing and packaging facility in the region. In Phase 1, which covers 2026 to 2027, the plant will have a total floor area of 1,600sq.m.

The facility will be equipped with functional testing lines, such as ATE testers and handlers, and dedicated reliability and durability testing area, which includes Burn-in, Reliability Test, and Failure Analysis Test.

In Phase 2 (2028–2030), FPT plans to expand the plant’s total area to approximately 6,000sq.m. These investments will include 18 newly installed functional testing lines, three reliability and endurance testing zones, expanded both conventional packaging lines (QFN, QFP, DFN, etc.), additional Chip Scale Package (CSP), Wafer Level Package (WLP) lines, along with advanced IC packaging lines. Therefore collectively ramping the plant’s total output to billions of units per year.

In parallel, FPT will strengthen its testing capabilities for high-end chips serving IoT, automotive applications, and AI-on-the-edge SoC solutions, further completing the semiconductor value chain.

29 January 2026