Taiwan Semiconductor Manufacturing Company Limited said it will expand further its advanced semiconductor manufacturing investments in the United States that will reach US$165 billion to date. Accordingly, the fresh investments will play crucial role not just in strengthening TSMC’s grit in the region but also in empowering United States’ domestic supply chain for artificial intelligence (AI)-related technologies and innovations.
The investment expansion covers an additional US$100 billion. Thus, will augment its current US$65 billion plan operations in Phoenix, Arizona.
The expansion includes plans for three new fabrication plants, two advanced packaging facilities and a major R&D team center, solidifying this project as the largest single foreign direct investment in U.S. history.
Boosts Semiconductor Value for AI
Through this expansion, TSMC expects to create hundreds of billions of dollars in semiconductor value for artificial intelligence (AI) and other cutting-edge applications.
Moreover, TSMC’s expanded investment will support 40,000 construction jobs over the next four years and create tens of thousands of high-paying, high-tech jobs in advanced chip manufacturing and R&D.
In addition, the Taiwanese company will likely drive more than US$200 billion of indirect economic output in Arizona and across the United States in the next decade. This move underscores TSMC’s dedication to supporting its customers, including United States’ leading AI and technology innovation companies such as Apple, NVIDIA, AMD, Broadcom, and Qualcomm.
“Back in 2020, thanks to President Trump’s vision and support, we embarked on our journey of establishing advanced chip manufacturing in the United States. This vision is now a reality,” said TSMC Chairman and CEO Dr. C.C. Wei. “AI is reshaping our daily lives and semiconductor technology is the foundation for new capabilities and applications.”
Moreover, Dr. Wei said, “With the success of our first fab in Arizona, along with needed government support and strong customer partnerships, we intend to expand our U.S. semiconductor manufacturing investment by an additional US$100 billion, bringing our total planned investment to US$165 billion.”
TSMC’s investment expansion is crucial not just for the company but for strengthening the U.S. semiconductor ecosystem. Specifically, this will increase American production of advanced semiconductor technology. Thus, completing the domestic AI supply chain with TSMC’s first U.S. advanced packaging investments.
TSMC’s Arizona fab currently employs more than 3,000 people on 1,100 acres of land in Arizona. The site has been in high-volume production for our N4 process technology since late 2024.
On the other hand, the second fab is on track for N3 process technology and beyond. The third facility will be producing N2 and A16 technologies. This will represent the most advanced semiconductor process technology in the United States.
Accordingly, TSMC Arizona’s first group of customers will be leading U.S. fabless and system companies; several of them are focused on high-performance computing applications such as
TSMC expects each fab will have cleanroom area approximately double the size of a standard logic fab in the industry. The exact capacity to be deployed at TSMC Arizona will depend on the level of customer demand and technology requirements.
In the United States, in addition to its latest manufacturing site in Phoenix, TSMC operates a fab in Camas, Washington, and design service centers in Austin, Texas, and San Jose, California.
04 March 2025