Taiwanese power management and smart green solutions provider Delta Electronics focused on how artificial intelligence (AI) is playing a crucial role on its manufacturing solutions at SEMICON Southeast Asia 2026. Specifically, the company demonstrated how AI has been instrument in enabling smarter, more connected, and advanced semiconductor packaging production to achieve greater speed, precision, and scalability.

Eng Yong Ch’ng, Country Manager at Delta Electronics Malaysia, said the adoption of advanced semiconductor packaging is accelerating. For that reason, manufacturers are facing extreme pressure to ramp up production faster that are cost efficient and scalable.

“At SEMICON Southeast Asia 2026, Delta (demonstrated) how a seamlessly integrated, connected, AI-enabled systems approach can help semiconductor manufacturers move beyond isolated performance improvements to achieve greater efficiency and consistency across their entire production lines,” said Ch’ng.

Precision Motion, Smart Equipment

Delta’s SEMICON Southeast Asia 2026 exhibit, which ran from May 5 to 7 at MITEC Exhibition Centre in Kuala Lumpur, Malaysia, focused on three key areas, namely AI-enabled smart equipment, precision motion, and energy-efficient infrastructure.

The company demonstrated its wide range of solutions that aim to meet stringent requirement of achieving consistent and high-speed precision as semiconductor components continue to shrink.

Delta presented its Multi-Axis Servo System (ASDA-W3), which features compact design with synchronized, high-speed multi-directional movement to support the precision and repeatability required in advanced assembly process. The Linear Positioning Link (LPL) for chip applications delivers sub-micron positioning accuracy to enable greater control and stability beyond what conventional motor systems can achieve.

The versatile FuzionSC semiconductor placement platform offers the highest accuracy across the largest board/panel dimension in the industry and still maintains 30,000cph speed. Often paired with High-Speed Wafer Feeder, the platform enables advanced multi-die placement with greater flexibility and efficiency. For market release in Q3 2026, the platform can support advanced semiconductor applications such as AI and photonics.

Delta also featured its Equipment Onboarding Suite, an integrated automation platform spanning the full equipment lifecycle, from virtual design to production and OT security. The platform, which comprises four core solutions, helps manufacturers to improve systems quickly and efficiently.

AI-Enabled Solution

Delta also showcased its AI Vision Solution for Smart Manufacturing (ACME) for the first time at SEMICON Southeast Asia. The AI-powered system monitors manual assembly processes in real time to detect errors, ensure compliance with standard operating procedures (SOPs), and provide immediate feedback for correction.

Using deep learning-driven video analytics, the solution identifies incorrect actions, missing or wrong components, and deviations in workflow as they happen, enabling operators to correct issues on the spot.

“The industry is shifting from focusing on individual machine performance to how entire systems perform,” said Jason Yuan, President, Southeast Asia and Australia & New Zealand, Delta Electronics. “In this environment, standalone machines are no longer enough. Equipment needs to be connected, able to communicate in real time, and capable of self-diagnosing issues before they affect operations. What matters now is how quickly systems can be deployed, how reliably they run, and how efficiently resources are used. This is where Delta’s integrated approach delivers real value across the production line.”

As semiconductor manufacturing scales, energy consumption and sustainability have become critical considerations. Delta’s solutions are designed to help manufacturers improve operational efficiency while reducing energy usage, supporting both performance and environmental goals.

06 May 2026