Toshiba Eyes New Facility to Expand Power IC Capacity

Toshiba Electronic Devices & Storage Corporation said it will construct a new back-end production facility for power semiconductors at its Himeji Operations – Semiconductor. The planned facility will rise in Hyogo Prefecture in western Japan.

Accordingly, the construction will start in June 2024, with production scheduled to start in spring 2025. Most importantly, the project will more than double Toshiba’s automotive power semiconductor production capacity at Himeji, against fiscal 2022.

Meets New Demands

Power devices are essential components for managing and reducing power consumption in all kinds of electronic equipment. Furthermore, they also play role for saving energy.

The progress of vehicle electrification and the automation of industrial equipment will continue down the road. For that reason, Toshiba has decided to meet this demand growth with construction of the new back-end facility.

Above all other products, demand for low-voltage metal oxide semiconductor field effect transistors (MOSFETs), a Toshiba focus technology.

Going forward, Toshiba will expand its power semiconductor business and boost competitiveness. Particularly, by offering high efficiency, high reliability products in response to fast growing demand. At the same time, to contribute to carbon neutrality.

Established in 1982, Toshiba’s Himeji Operations – Semiconductor now employs about 1,400 employees. Its main product outputs include are discrete semiconductors, such as power semiconductors and small-signal devices.