Toshiba to Double Power IC Output in Planned 300mm Fab

Toshiba Electronic Devices & Storage Corporation said Friday it will construct a new 300mm wafer fabrication facility for power semiconductors. Particularly, the new facility will rise at its main discrete IC production base in Kaga Toshiba Electronics Corporation in Japan’s Ishikawa.

Construction will take place in two phases. Accordingly, this will allow optimized pace of investments against market trends. Production of Phase 1 will start in 2024.

Thus, when Phase 1 reaches full capacity, Toshiba’s power IC capacity will be 2.5 times that of 2021, with combined 200mm and 300mm capacity.  

Artist’s rendition of the new 300mm wafer fabrication facility (the building on the right)

Meet Demands of EVs, Industrial

Power devices are essential components for managing and reducing power consumption in every electronic equipment. Furthermore, these are essential to achieve a carbon neutral society.

Current demand is expanding on vehicle electrification and the automation of industrial equipment. This shows very strong demand for low-voltage metal oxide semiconductor field effect transistors (MOSFETs) and insulated-gate bipolar transistors (IGBTs) and other devices.

Currently, Toshiba has met this demand growth by increasing production capacity on 200mm lines. In addition, it will expedite the start of production of 300mm production lines from the first half of fiscal 2023. Toshiba said decisions on the new fab’s overall capacity and equipment investment, the start of production, production capacity, and production plan will reflect market trends.

Utilize AI, Automation

Toshiba said the new fab will have a quake absorbing structure and enhanced business continuity plan (BCP) systems. Moreover, this includes dual power supply lines and the latest energy saving manufacturing equipment to reduce environmental burdens.

The new facility will also aim to achieve the “RE100” goal, meaning having reliance on renewable energy.

Furthermore, the company said it will introduce artificial intelligence and automated wafer transportation systems to improve product quality and production efficiency. In addition, Toshiba said it will expand its power semiconductor business and boost competitiveness by timely investments and research and development.