Saki to Showcase 3D Inspection Systems at NEPCON Asia 2021

Saki Corporation will take part at NEPCON Asia 2021 to be held from August 25 to 27 in Shenzhen, China through its Chinese subsidiary Saki China, aiming to expand its market in China in collaboration with its distributor. Saki will exhibit its latest three-dimensional (3D) solder paste inspection (3D-SPI) and 3D automatic optical inspection (3D-AOI) systems, and other equipment.

Following NEPCON China 2021, which was held last April in Shanghai, Saki’ will exhibit its products at NEPCON Asia 2021 together with Shenzhen-based Shenzhen SK Electronics (SKE), which is the company’s distributor in China.

Saki is set to participate at NEPCON Asia 2021 together with its distributor Shenzhen SK Electronics .

The company will display, along with the 3Si-LD2 3D-SPI system dual-lane model that supports L-size substrates, the 3Di-LS2 3D-AOI system single-lane model that also supports L-size substrates.

The 3Di-LS2 3D-AOI system is equipped with the Z-axis drive optical-head control feature. The latest Z-axis drive optical head system expands the AOI system’s height measurement range in the 3D mode up to 40mm and two-dimensional (2D) focus up to 40mm in height. As the 2D focus height has been expanded, the AOI system can identify components with high profiles, such as large electrolytic capacitors. It can also simultaneously perform solder inspection and character recognition on the upper surface of components [optical character recognition (OCR) and optical character verification (OCV)] and polarity inspection by focusing both the substrate surface and component surface. The Z-axis drive optical head system also enables the AOI system to achieve high-quality inspection accuracy in automatic inspection of high-profile components, press fit components, and substrates transferred by jigs.  

The 3D-AOI system equipped with Z-axis drive optical head system.

The 2Di-LU1 2D bottom surface AOI system dedicated for through hole solder adopts the common software platform with 3D-SPI and 3D-AOI systems. The 2D-AOI system is dedicated for automatic inspection of the bottom surface of substrates. It automates all processes of selective wave dip soldering, guarantees quality of through hole solder components, and improves productivity. The use of a common system option for the SPI and AOI systems enables unified operation and reduces the workload on the operator, thereby suppressing various running costs.

Aiming to support customers’ manufacturing issues, Zheng Ri, General Manager of Saki China, says, “Manufacturers of electronics products strongly require equipment manufacturers to always provide more complex products with high quality level at the same time with improved throughput and reduced costs. Our company does its utmost to solve these issues customers in Shenzhen and around the world are facing, together with SKE, our sales partner in China.”

Together with NEPCON China, NEPCON Asia displays the largest array of manufacturing equipment in China, focusing on surface mounting-related equipment. The international event attracts 600 exhibitors from about 40 countries and regions. About 45,000 buyers are expected to visit the three-day event this year.