Plasma-Therm, a leading manufacturer of plasma-process equipment for the semiconductor and compound semiconductor markets, has acquired Thin Film Equipment SrL (TFE). Based in Binasco (Milano, Italy), TFE is a leading supplier of sputtering equipment for semiconductor R&D and production. Also, the company is well-known for its expertise in physical vapor deposition (PVD) sputtering and evaporation process equipment and high-purity materials for thin film applications.

“The acquisition of TFE reinforces Plasma-Therm’s expanding footprint in Europe, a pivotal component of our long-term strategic growth initiative,” stated Abdul Lateef, CEO of Plasma-Therm. “It also helps to significantly expand Plasma-Therm’s portfolio in the power device market with TFE’s suite of PVD tools. Specifically, they are tailored to meet the requirements of MEMS, Power, RFID, and other semiconductor applications.”

Mainly, TFE’s PVD technologies highly complement Plasma-Therm’s existing etch and deposition products and process solutions. Collectively, they enhance TFE’s ability to meet a wider spectrum of semiconductor manufacturing and R&D market demands. Also, the added value of TFE’s workforce expertise in PVD technology and power device market requirements further strengthens Plasma-Therm’s renowned customer service and support teams.

According to The Yole Group’s “Power SiC 2022” report, the power semiconductor market will reach a substantial US$6.3 billion by 2027. Specifically, Plasma-Therm is positioned to support this growth with the acquisition of TFE and the MRC Eclipse product line. The latter are for depositing metal for interconnects, via fill, silicides, packaging (C4, die attach), and other processes.

Francesco Terenziani, CEO, TFE, commented, “We are excited about this acquisition and combining our strengths with Plasma-Therm’s. TFE will continue to operate independently. At the same time, we will work closely with Plasma-Therm to combine our strengths in plasma and PVD process technology. Thus, it will enable more comprehensive product offering for our customers. Mainly, this will enable us to expand our R&D resources and customer service & support teams globally to deliver timely solutions to our valued customers.”