Infineon, Honda Partner on Automotive Chip Solutions

Infineon Technologies AG and Honda Motor Co., Ltd. have signed a Memorandum of Understanding (MoU) to build a strategic collaboration. Particularly, Honda has selected Infineon as a semiconductor partner to align future product and technology roadmaps.

Moreover, the two companies also agreed to continue discussions on supply stability. They also agreed to encourage transferring mutual knowledge and collaborate on projects aimed at accelerating the time to market of technologies.

Trusted Partner of Japan’s Automotive Industry

Peter Schiefer, President of the Automotive Division at Infineon said the company enjoys deep system understanding and a broad portfolio with outstanding quality. Thus, they have become a partner in Japan’s automotive industry.

Furthermore, Schiefer said, “Intensifying a long-standing partnership (with Honda) even further is always a confirmation of the added value created and at the same time an expression of the trust in contributing to future successes.”

Infineon will support Honda with technologies to enable competitive and advanced vehicles. Particularly, the technical support will focus on power semiconductors, Advanced Driver Assistance Systems (ADAS), and E/E architectures. Most importantly, both parties will collaborate on new architecture concepts based on the aforementioned core focus.

Infineon Technologies is a global semiconductor leader in power systems and IoT. Moreover, Infineon drives decarbonization and digitalization with its products and solutions.

Presently, the company has around 58,600 employees worldwide and generated revenue of about €16.3 billion in the 2023 fiscal year (ending 30 September).

Meanwhile, Honda remains one of the global leading brands in mobility, having sold 28.08 million units in fiscal year ending March 2022. Moreover, it has a consolidated sales revenue of 16.90 trillion yen with a consolidated operating profit of 780.7 billion yen.