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ASIA ELECTRONICS INDUSTRYYOUR WINDOW TO SMART MANUFACTURING

Rapidus Boosts Global Grit as it Opens New U.S. Office

Japanese semiconductor company Rapidus Corporation has formed a U.S. subsidiary, Rapidus Design Solutions (RDS). Accordingly, the company has been sustaining its global momentum, for barely two years since its establishment.

Rapidus has been researching, developing, designing, manufacturing, and selling advanced logic semiconductors.  

In expanding its presence, the company opened RDS in Santa Clara and named long-time semiconductor executive Henri Richard as general manager and president. In this role, Richard leads overall business development efforts for Rapidus in the United States.

RDS will serve fabless semiconductor companies, technology partners, and others in the Americas. Particularly, those interested in accelerating time to market for the world’s most advanced semiconductors.

From left to right, Dr. Mukesh Khare, general manager, IBM Semiconductors and vice president, Hybrid Cloud Research, IBM; Dr. Atsuyoshi Koike, president and CEO, Rapidus Corporation; Henri Richard, general manager and president of Rapidus Design Solutions, LLC.

Richard brings decades of leadership experience in sales, marketing, and customer support to his new role. He has held executive positions at a wide range of industry-leading companies including AMD, Freescale, IBM, NetApp, SanDisk, and others. Accordingly, Richard has strong relationships in the industry and has already assembled the core leadership team for Rapidus Americas sales and marketing.

“When Rapidus knocked on my door, I couldn’t resist the opportunity to work with an extremely talented and passionate team that is changing the way semiconductors are designed and produced. Thus, providing an alternative to current manufacturers and shaking up traditional manufacturing approaches,” said Richard. Moreover, Richard said, “With AI transforming every industry, the demand for advanced semiconductors is on the rise. I am extremely excited to be part of this company.”

Global Momentum

These U.S. milestones build on the momentum Rapidus has seen worldwide since its founding two years ago. Earlier, the company announced the approval of two projects by the Japanese government. Namely, the extension of its 2nm-foundry front-end project for wafer development and the new back-end focus area on packaging. Particularly, the development of chiplet package design and manufacturing technology for 2nm semiconductors.

The company offers comprehensive support of both the front-end and back-end processes, as well as providing design solutions. Thus, Rapidus will enable its fabless semiconductor customers to achieve the world’s fastest time-to-market for the production of advanced devices.

Rapidus got its start in 2022 with investments from the Japanese government as well as prominent Japanese firms including. Namely, Sony and Toyota, as well as strategic partnership with IBM for the development of 2nm mode technology.

Its manufacturing facility, the Innovative Integration for Manufacturing (IIM), is currently under construction in Hokkaido, Japan.

Best Support from Japan, United States

“We’re at an important inflection point for semiconductor manufacturing as there must be collaboration among multiple countries, governments, and foundries. The development of advanced node technology is essential to lessen power consumption, and in turn help to address climate change challenges to realize a better world,” said Dr. Atsuyoshi Koike, president and CEO, Rapidus Corporation.

Moreover, Koike said the opening of its new office in Silicon Valley is a testament of the company’s best support to its customers. Particularly, to address their design and manufacturing needs.

The Santa Clara office is an extension of Rapidus’ existing presence in the United States. More than 100 Rapidus scientists and engineers are currently working alongside IBM researchers at the Albany NanoTech Complex owned and operated by NY CREATES in Albany, New York. Accordingly, this is one of the world’s most advanced semiconductor research facilities.

-18 April 2024-