Barely a year after the joint development, important progress has happened in producing smart power technologies. Moreover, Fraunhofer IPMS provided significant support to Infineon. Specifically, by supplying selected process modules within the entire CMOS process value chain on 300mm wafers.
The collaboration played a key role in the process development for the factory expansion at Infineon Dresden. Accordingly, the collaboration resulted in the processing of over 2,000 wafers. The wafers were exchanged several times between Fraunhofer IPMS and Infineon Dresden to ensure optimal use of resources and optimum integration into the production lines.
“The results of this joint project are extremely promising and mark a significant step forward for the production of smart power technologies at Infineon Dresden,” commented project manager Andreas Thamm from Infineon. In addition, Thamm said, “The close collaboration and the provision of process modules by Fraunhofer IPMS have enabled us to move ahead faster than planned.”
The successful implementation of this project underlines the technological expertise and effective collaboration between Fraunhofer IPMS and its cooperation partners. In fact, several joint projects have already been completed with semiconductor expert Infineon proved to be valuable.
IPMS project manager Dr. Malte Czernohorsky confirmed they have been working together for years. “In this project, Fraunhofer experts worked closely with colleagues from Infineon. The teams are (familiar) to each other…our colleagues at Infineon were very accommodating towards our ideas. Based on the positive experiences from previous years, we are already thinking about follow-up projects.”
This milestone and the expansion of capacities in the Smart Power Fab area illustrate Infineon’s ongoing efforts. Specifically, to further strengthen its position as a leading supplier of high-performance circuits, particularly at the Dresden site. With the construction of the new Smart Power Fab, Infineon is making one of the largest single investments in its history.
The semiconductor manufacturer aims to increase the speed at which it expands its semiconductor production capacities. Furthermore, it also aims to further strengthen Europe as a chip manufacturing location. This is an important contribution to meeting the growing global demand for semiconductors. For example, for applications to generate renewable energy, for use in data centers, and for electromobility.
The European Union, the German Federal Ministry for Economic Affairs and Climate Protection, and the Free State of Saxony are funding Infineon’s work. It forms part of an Important Projects of Common European Interest (IPCEI) in the fields of microelectronics and communication technologies.
Moreover, the funding supports the development of future-oriented, innovative microelectronics and communication technologies up to market maturity. The aim is to complete the European value chain and contribute to European technological sovereignty. In addition, to promote climate protection through energy-efficient technologies and processes.
24 May 2024