Rapidus and IBM Advance on 2nm Chiplet Alliance

Rapidus Corporation and IBM have announced a joint development partnership aimed at establishing mass-production technologies for chiplet packages. Through this agreement, Rapidus will receive packaging technology from IBM for high-performance semiconductors. Mainly, the two companies will collaborate to further innovate in this space.

Primarily, this agreement is part of an international collaboration within the framework of the “Development of Chiplet and Package Design and Manufacturing Technology for 2nm-Generation Semiconductors” project being conducted by Japan’s New Energy and Industrial Technology Development Organization (NEDO). Additionally, it builds on an existing agreement with IBM for the joint development of 2nm node technology.

As part of the agreement, IBM and Rapidus engineers will work in collaboration at IBM’s facilities in North America. Particularly, it involves R&D and manufacturing of semiconductor packaging for high-performance computer systems.

Atsuyoshi Koike (left), President and CEO, Rapidus, and Norishige Morimoto (right), Vice President of IBM Japan, Chief Technology Officer, IBM Research & Development

Leverage Respective Manufacturing Expertise

Over the years, IBM has accumulated R&D and manufacturing technologies for semiconductor packaging for high-performance computer systems. Primarily, it has a wealth of experience with joint development partnerships with Japanese semiconductor manufacturers. Also, it has rich partnerships with manufacturers of semiconductors, package manufacturing equipment, and materials. Meanwhile, Rapidus aims to leverage this expertise to quickly establish cutting-edge chiplet packaging technology.

Rapidus President and CEO Dr. Atsuyoshi Koike commented, “Building on our current joint development agreement for 2nm semiconductor technology, we are extremely pleased to officially announce today this partnership with IBM to establish chiplet packaging technology.”

Koike stressed, “We will make the most of this international collaboration. Also, we will pursue initiatives that will allow Japan to play an even more important role in the semiconductor packaging supply chain.”

Darío Gil, SVP and Director of Research at IBM, said, “With decades of innovation in advanced packaging, IBM is honored to expand our collaboration with Rapidus to develop state-of-the-art chiplet technology. Through our agreement, we are committed to supporting the development of the most advanced node production processes, design, and packaging. (Also, we will be) developing new use cases and supporting the semiconductor workforce.”

-05 June 2024-