MediaTek and TSMC have jointly demonstrated Wednesday (March 12) the first silicon-proven power management unit (PMU) and integrated power amplifier (iPA) on TSMC’s N6RF+ process.

What makes this feat significant is because it has become possible to integrate these two essential components into a system-on-chip (SoC) on an advanced RF process for wireless connectivity products. Thus, enabling a significantly smaller form factor while enjoying performance competitive with stand-alone modules.

Supports Efficient, Advanced Wireless Applications

The smaller area enabled by TSMC’s advanced N6RF+ technology can reduce the size of the wireless connectivity product module by a double-digit percentage. In addition, TSMC and MediaTek’s results showed significant improvement in power efficiency for the PMU compared with existing solutions, while iPA performance was competitive with benchmark products. As the world’s leading supplier of wireless connectivity solutions, MediaTek is well positioned to leverage these advancements to ensure top product performance as it shifts towards the next generation.

As a backgrounder, TSMC’s N6RF+ is an advanced RF CMOS process technology built on the N6 logic platform. Specifically, it is designed to enable future generations of WLAN and 5G RF transceiver integrated circuits. Thus, supporting efficient and advanced wireless applications.

Because of this technology, it can offer enhanced performance and efficiency. In short, it enables high-performance wireless connectivity with better battery life. Moreover, it can enable smaller form factors for end products. Finally, TSMC has made possible significant improvement in power efficiency for PMU compared with existing solutions.

Emerging Competitive Technology

TSMC considers the collaboration with MediaTek as a direct result of its Design-Technology Co-Optimization (DTCO). Specifically, MediaTek drew on its product and design expertise to drive system and technology requirements for this project, and TSMC enhanced its technology to enable differentiation in the products.

“After a year of working together on N6RF+, the test chip has exhibited excellent power efficiency gains,” said Ching San Wu, Corporate Vice President at MediaTek. “By combining MediaTek’s leadership in wireless technology and TSMC’s expertise on DTCO, N6RF+ will become a competitive technology for RFSOC projects, creating a significant advantage in the industry.”

“Successful DTCO between foundry and customer requires strong mutual trust and teamwork, and we are delighted in this joint accomplishment with a wireless connectivity leader like MediaTek,” said Lipen Yuan, senior director of Advanced Technology Business Development at TSMC. “This achievement on TSMC’s N6RF+ process shows how TSMC combines its leadership in advanced logic and broad portfolio of specialty technologies to provide differentiated solutions for customers’ products.”