The second term of U.S. President Donald Trump has resulted in the influx of investments in the United States from manufacturing companies. This has spurred in trillions of dollars of investments in the United States manufacturing, production, and innovation.

Another U.S. company, Texas Instruments, has announced plans to invest more than US$60 billion across seven U.S. semiconductor fabs. Most importantly, it said the amount comprises is the largest investment in foundational semiconductor manufacturing in the United States.

Specifically, TI is expanding its U.S. manufacturing capacity to supply the growing need for semiconductors. These chips will advance critical innovations from vehicles to smartphones to data centers. Moreover, TI’s mega-sites in Texas and Utah will support more than 60,000 domestic jobs.

TI President and CEO Haviv Ilan said TI is building dependable and low-cost 300mm capacity at scale. Accordingly, this aims to deliver the analog and embedded processing chips that are vital for nearly every type of electronic system.

In fact, Ilan said leading U.S. companies such as Apple, Ford, Medtronic, NVIDIA, and SpaceX rely on TI’s technology and manufacturing expertise.

Robust Manufacturing Strength

TI has been one of the driving forces behind the return and expansion of semiconductor manufacturing in the United States. The company’s more than US$60 billion investment includes building and ramping seven, large-scale, connected fabs. Combined, these fabs across three manufacturing mega-sites in Texas and Utah will manufacture hundreds of millions of U.S.-made chips daily. Thus, igniting that a bold new chapter in American innovation.

In its Sherman facility in Texas, the SM1 is TI’s first new fab that will begin initial production this year, just three years after the breaking ground. Meanwhile, the SM2, TI’s second new fab in Sherman, the construction of the exterior shell has already been completed.

The new investments  will also cover two additional fabs, the SM3 and SM4 also in Sherman, to support future demand.

At Richardson in Texas, TI’s second fab, the RFAB2, continues to ramp to full production. It builds on the company’s legacy of introducing the world’s first 300mm analog fab, RFAB1, in 2011.

On the other hand, in Lehi, Utah, TI is ramping LFAB1, the company’s first 300mm wafer fab in Lehi. Construction is also well underway on LFAB2, TI’s second Lehi fab that will connect to LFAB1.

TI has emerged as one of the largest foundational semiconductor manufacturers in the United States. Thus far, it has been producing analog and embedded processing chips that are critical for smartphones, vehicles, data centers, satellites, and nearly every other electronic device.

23 June 2025