Ushio Inc. has announced the development outlook for the UX-59113, a stepper for advanced packaging. Specifically, it aims to achieve a resolution of L/S=1.5μm and an exposure field of 100mm square or more per shot. Ushio plans to launch the product to the market in 2026.

The UX-5 series is a lithography equipment for cutting-edge IC package substrates, featuring a 90 percent global market share*, and is used to expose semiconductor package substrates built into a variety of devices, including PCs, smartphones, and tablet devices.

Improves Yield, Productivity

The spread of IoT and the emergence of generative AI is driving increased demand for high-performance semiconductors for data centers. Moreover, advanced packages such as chiplets are seeing increasingly miniaturized interconnects and larger package sizes, driving market needs for alternatives to silicon interposers and full panelization. This is likely to drive increased demand for panel-level packaging using resin and glass substrates.

With conventional steppers for wafer, larger package substrates require stitching, which involves connecting multiple shots for exposure. However, misalignment during stitching can lead to issues with reduced yield and productivity. This product enables single-shot, stitch-less exposure of substrates 100mm square or larger at 1.5μm resolution, improving yield and productivity during mass production.

It addresses the critical issues of warping and undulation that commonly occur during mass production of glass substrates and full-panel size substrates, which are gaining attention as next-generation technologies. Its new platform leverages the advanced handling technologies we have developed through extensive experience with semiconductor package substrates to effectively solve these challenges.

Ushio will advance the functionality of steppers for advanced package substrates to the world’s highest level by leveraging the unique optical design technology it has cultivated since its founding and the know-how it has accumulated over many years working with customers in the IC package substrate industry.

Lithography Equipment Lineup

Ushio has been aiming to expand and grow further its advanced packaging business. In fact, the company announced in December 2023 that it has co-developed with Applied Materials the Digital Lithography Technology (DLT) system. The system aims to achieve high resolution and throughput for patterning substrates like wafers and large panels, including glass and organic materials.

This allows Ushio to steadily build a full lineup that meets the diverse needs of customers for next-generation packaging substrates, where technological innovation is advancing.

With the addition of the new stepper product UX-59113, which is compatible with interposer substrates that play an important role in advanced packaging, to the stepper lineup, the company is able to build a comprehensive product lineup that meets a wider range of customer needs. At the same time, it is able to contribute to technological innovation in next-generation package substrates, particularly for generative AI semiconductors.

As a leading company in lithography equipment for cutting-edge IC package substrates, Ushio will continue to contribute to the realization of a convenient and comfortable society through its “light” technology.

06 Aug 2025