Socionext, the Solution SoC company, has made the 3DIC support available in its portfolio for the delivery of complete solutions for consumer, AI, and HPC data center applications. These include chiplets, 2.5D, 3D, and 5.5D packaging.

For that reason, Socionext empowers customers with a proven development process and unmatched expertise delivering high-performance, high-quality solutions that accelerate innovation and success.

This means Socionext has successfully taped out a complete packaged device leveraging TSMC’s SoIC-X 3D stacking. The design combines an N3 compute die and an N5 I/O die in a face-to-face (F2F) configuration. The F2F 3D stacking approach minimizes interconnect distance, significantly reduces signal latency and power consumption compared to traditional 2D and 2.5D designs.

Solid Potential With 3DIC Design

Building on the company’s experience in 2.5D designs, Socionext applies proven design experience and methodologies to 3DICs, which stack components vertically to unlock key advantages.

First, 3D ICs enable the heterogeneous integration of different technology nodes, such as 3nm, 5nm, 7nm, and functions, such as logic, memory, interface, into a single package. Therefore, allowing for a more optimally partitioned solution addressing performance, density, and cost.

Another advantage is that vertical stacking enables greater functionality in a smaller footprint—an essential advantage as traditional scaling nears its limits. This is especially valuable for space-constrained consumer devices.

Vertical 3DIC stacking also means shorter, wider connections between dies reduce latency and boost bandwidth, therefore yielding improved performance. Furthermore, another advantage is that compact interconnects result in reduced drive requirements due to lower impedance.

Vision for the Future

The introduction of 3DIC, along with 5.5D support, reflects Socionext’s strong focus on advancing heterogeneous integration. Thus, bringing together multiple functions within a unified system of semiconductors and packaging elements. As demand grows for scalable, high-density, and energy-efficient platforms, especially in consumer, AI, and data center applications, 3DICs will play a pivotal role in shaping the future of semiconductor innovation.

“Socionext’s extensive experience in SoC design and our collaboration with TSMC position us at the forefront of next-generation SoC development,” said Rajinder Cheema, CTO and Executive Vice President at Socionext. “This milestone reflects our dedication to delivering cutting-edge solutions that meet the evolving needs of our customers.”
01 September 2025