Taiwan Semiconductor Manufacturing Company Limited (TSMC) continues to expand its collaboration with Japanese companies.

Recently, the Taiwanese conglomerate has brought together semiconductor design partners and customers in a forum in Tokyo. Here, TSMC underscored its partnership with IBIDEN Co., Ltd. on large-scale substrates.

The company is working to significantly improve productivity and shorten design time.

TSMC held for the first time its Open Innovation Platform (OIP) Ecosystem Forum in Tokyo. Particularly, the forum explored the latest technologies and design solutions for next-generation artificial intelligence (AI), HPC, mobile, and IoT applications.

The company is working on 3D ICs intending to significantly improve design efficiency. Moreover, it is promoting the integration of memory, substrates, and packaging. It is also collaborating with more than 20 companies in Japan to develop materials. Furthermore, the Taiwan tech giant is also digging deeper on research and development in areas such as power saving and heat dissipation.

As the demand for generative AI and large language models (LLMs) expands, the need for 3D ICs is also increasing. TSMC is also working to come up with a common system with EDA companies engaged in circuit design. At the same time, it provides designers with critical information to make early design decisions with comprehensive design solutions.

Because of the collaborative efforts, TSMC was able to make it possible to shorten the design time until final implementation. It has also launched as 3Dblox technology group.

10x More Productivity

On the other hand, as the size of the substrate increases, it becomes even more important to prevent warping and flattening it. Moreover, to take measures against heat.

In collaboration with IBIDEN, TSMC is working on board design technology, including the introduction of automation, to significantly improve efficiency and productivity. With automation, the company aims to increase productivity up to 10 times.

Koji Kawashima, Director & Senior Executive Officer, IBIDEN, and Hisato Yoshida, Board Director, Socionext Inc. also took the stage at the forum. The companies gave their respective presentations and initiatives.

Yutaka Emoto, Vice President and Center General Manager of the TSMC Japan 3DIC R&D Center and Dan Kochpatcharin, Head of Design Infrastructure Management Division, TSMC graced the press briefing. Particularly, they underscored their intention to further expand and promote alliances with Japan companies.