EV Group has unveiled the next-generation EVG120 automated resist processing system — a major update to one of the company’s leading coater/developer platforms. Incorporating a new compact architecture, breakthrough capabilities, and design enhancements leveraged from the widely adopted EVG150 system, the new EVG120 delivers significantly higher throughput, greater flexibility, and improved process control compared to the previous generation.

Ideal for advanced packaging, MEMS, image sensors, photonics, power devices, wafer probe cards, and other fast-growing application areas, the next-generation EVG120 supports spin coating, spray coating and developing of photoresist materials used in photolithography. It accommodates a wide range of substrate types and sizes (from 2 inches up to 200 mm), and supports a variety of resist materials, including thin, thick, positive tone and negative tone, dielectric materials such as PI and PBO, as well as black/color/IR resists for specialty applications.

New Platform, Expanded Capabilities

The EVG120 has been redesigned around a compact 200-mm platform that integrates up to two wet processing modules and 14 bake/chill plates — a 40-percent increase in capacity over the previous-generation platform. The system’s footprint has also been reduced by more than 20 percent, while design improvements enable easier access for tool maintenance and flexible modular configuration.

The system also introduces multiple new capabilities not available on earlier generations, including:

• Wafer Edge Exposure (WEE) – enables selective edge exposure for improved edge accuracy and uniformity
• In-situ Resist Thickness Measurement – enables real-time process monitoring for improved yield and process control (measurement range: 50 nm to 50 micron)
• Enhanced High-Viscosity Dispense System – high-pressure dispensing with closed-loop feedback provides precision coating performance on thick photoresists
• Support for SMIF Loadports – enables cleaner and more efficient material handling
• Stand-by Mode – reduces energy consumption during idle periods; supports SEMI E167 compliance

These additions build upon EVG’s proven coating technologies such as its innovative CoverSpin™ bowl design, which provides superior uniformity and reduces material consumption, and its proprietary OmniSpray conformal spray coating technology, which provides optimal coating of surfaces with severe topographies and fragile substrates.

19 February 2026