
To sustain its grit in the growing global demand for high-efficiency power semiconductors, ROHM Co., Ltd. has announced its strategic pivot in its gallium nitride (GaN) roadmap. With the integration of its its development and manufacturing technologies with TSMC’s process, the Japanese company is moving to an end-to-end production system within the ROHM group.
Moreover, the deeper manufacturing relationship between ROHM and TSMC will strengthen supply capability to meet the growing demand for GaN in AI servers and electric vehicles applications.

Meeting the AI Infrastructure Bottleneck
The rapid expansion of AI data centers resulted in a critical industry bottleneck. That is, traditional power supplies would not be able to hold up the density requirements of modern GPU clusters. For that reason, ROHM’s strategy is to license TSMC technology and this will allow the Japanese company to scale their EcoGaN lineup to maximize energy conservation and miniaturization.
With its end-to-end system, ROHM is addressing critical issues for its customers. First, its production within the group allows tighter synergy between ROHM’s discrete device expertise and the fabrication process.
Second, with the technology process based in Japan, ROHM was able minimize potential geopolitical and logistics risks for regional manufacturers. Furthermore, having the 650V GaN in its portfolio targets the sweet spot required for AI server power supply units and on-board chargers for EVs.
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The partnership of ROHM and TSMC is not new since the former has already utilized the latter’s 650V process since 2023. In fact, this also resulted in a more strategic automotive GaN partnership in December 2024.
Therefore, the latest move to license the technology for in-group use ensures ROHM’s portfolio can meet the massive volume demands that are in the offing because of the AI and EV surge.
27 February 2026