Fasford Technology, a subsidiary of Fuji Corporation, has announced the world premiere of XERDIA, its next-generation flagship die bonder.

Scheduled for its global debut at SEMICON CHINA 2026 in Shanghai from March 25 to March 27, XERDIA represents a significant leap in semiconductor backend manufacturing technology.

Addressing Advanced Packaging Needs

As semiconductor devices evolve toward higher memory capacity and functionality, the industry requires high-precision bonding to ensure device reliability. Driven by the explosive growth of generative AI and data processing demands, XERDIA was developed to meet the dual requirements of extreme accuracy and high-volume productivity.

A New Benchmark in Performance

XERDIA is the first system developed entirely from the ground up since Fasford Technology joined the FUJI Group in 2018. While it inherits the proven design philosophy of the DB830/DB850 series, the platform has been completely redesigned. Key performance upgrades include:

·  Higher Precision: Bonding accuracy has improved from $5~\mu m$ to $3~\mu m$.

·  Increased Throughput: Productivity has jumped from UPH 4,000 to UPH 5,500.

·  Vibration Reduction: A high-rigidity system frame reduces vibration by 50% compared to previous models.

Strategic Synergies and Sustainability

The development of XERDIA leverages deep technological synergies within the FUJI Group, incorporating high-performance linear motors from Fuji Linear Corporation. Beyond performance, the “Green by Design” concept focuses on environmental impact. The machine achieves a 30% improvement in footprint productivity and features an “ECO Mode 2.0” that reduces power consumption during idle operation by 26%.

To ensure a seamless transition for existing customers, XERDIA is designed to be compatible with current DB series assets, including tools and process recipes.

Availability and Exhibition

Attendees of SEMICON CHINA 2026 can view the XERDIA reference exhibit at the booth of distributor JIPAL Corporation (Hall N4 / Booth No. 4151). Additionally, FUJI will showcase automation solutions, including the NXTR SMT pick and place machine, at Hall E4 / Booth No. 4342.

The official commercial release of XERDIA is scheduled for June 2026.