Rapidus Corporation has taken a decisive step toward advanced semiconductor mass production with the opening of its new Analysis Center and the launch of Rapidus Chiplet Solutions (RCS), reinforcing Japan’s ambition to regain strategic leadership in next-generation logic chips.

Located next to Rapidus’ Innovative Integration for Manufacturing (IIM‑1) foundry in Chitose, Hokkaido, the Analysis Center provides the comprehensive analytical capabilities required for cutting-edge semiconductor development. The facility supports physical, environmental, and chemical analysis, along with electrical characterization and reliability testing—essential functions for validating advanced logic processes ahead of commercial manufacturing.

Connects Front-End, Back-End Processes

At the same time, Rapidus has moved RCS into full-scale operations. RCS operates from a dedicated cleanroom at Seiko Epson Corporation’s Chitose Plant, enabling close coordination between front‑end wafer fabrication and post‑production research and development.

The RCS facility was established as a post‑production R&D hub focused on advanced semiconductor packaging and chiplet technologies. After beginning setup in late 2024, Rapidus installed manufacturing equipment in 2025 and operated the site at limited capacity, including the production of a prototype 600mm square redistribution layer (RDL) interposer panel. With the cleanroom now complete, RCS has officially transitioned into full-scale operation.

Together, the Analysis Center and RCS create an integrated development environment that connects front‑end manufacturing with advanced back‑end processes. As chiplet architectures and advanced packaging become increasingly critical at leading‑edge nodes, this vertically integrated approach positions Rapidus to shorten development cycles while improving yield, reliability, and manufacturability.

The opening of both facilities was marked by an official ceremony attended by senior national and regional leaders, highlighting the strategic role Rapidus plays in Japan’s semiconductor industrial policy and long‑term supply‑chain resilience.

Rapidus’ 2nm Roadmap: Background

Rapidus was founded to develop and manufacture next‑generation logic semiconductors, with a core focus on 2nm‑generation technology. Under Japan’s national next‑generation semiconductor initiatives, the company has been advancing front‑end process development at its IIM‑1 foundry, including the verification of 2nm gate‑all‑around (GAA) transistor operation on 300mm wafers and the preparation of process design kits (PDKs) for early customers.

In parallel, Rapidus is building mass‑production capabilities for back‑end and chiplet technologies through Rapidus Chiplet Solutions. Supported by government‑backed R&D programs, the company is developing advanced packaging, redistribution layer interposers, and 3D integration flows designed specifically for 2nm‑class semiconductors. These combined front‑end and back‑end investments underpin Rapidus’ goal of achieving stable, high‑volume production of advanced logic chips in the second half of fiscal year 2027.

13 April 2026