AMD Advances Future Processors With 3D Chiplet Technology

Advanced Micro Devices, Inc. (AMD) made breakthrough in high-performance computing with the new 3D chiplet technology. The latest innovation, developed in collaboration with Taiwan Semiconductor Manufacturing Company, Limited (TSMC), will allow the company to stack multiple chips onto each other. 

In a keynote speech at the first virtual COMPUTEX 2021, AMD President and Chief Executive Officer Lisa Su said the new 3D V-cache stack chiplet technology is the next generation in chip design. 

AMD President and Chief Executive Officer Lisa Su shows a prototype of the new 3D chiplet technology.

“The next frontier of innovation in our industry is taking chip design into the third dimension. Our first application of 3D chiplet technology at COMPUTEX demonstrates our commitment to continue pushing the envelope in high-performance computing to significantly enhance user experiences,” said Su, who has shown a prototype Ryzen 9 5900X processor with 3D chiplet technology stacking a 64MB 7nm SRAM directly on top of each core complex, effectively tripling the amount of high-speed L3 cache, speeding Zen 3 cores. 

Employs Hybrid Bond Approach

The 3D chiplet technology combines triplet packaging with die stacking to create 3D chiplet architecture. The 3D cache is bonded directly to the Zen 3 CCD with TSVs passing signals and power between the stacked chips, supporting more than 2TB/sec of bandwidth. AMD, through the manufacturing process, thinned the 3D cache die and added structural silicon to create a seamless surface for the combined chip. 

“In an actual device, the individual SRAM is bonded to each CCD so you get 96MB of cache from CCD or 192MB total for our 12 or 16-core Ryzen core processor in a single package,” said Su. 

AMD’s innovative chiplet architecture with 3D stacking will use an industry-leading hybrid bond approach that provides over 200 times the interconnect density of 2D chiplets and more than 15 times the density compared to existing 3D packaging solutions. It consumes less energy than current 3D solutions.

Su also announced the expanded adoption of AMD computing and graphics technologies in the automotive and mobile markets with industry leaders Tesla and Samsung. She also discussed the new AMD Ryzen processor offerings for gaming enthusiasts and consumer PCs, as well as leadership data center performance with the latest 3rd Gen AMD EPYC processors, and a full slate of new AMD graphics technologies for gamers.