Yamaha Motor Co., Ltd. announced that it will release the new solder paste printer*¹ YRP10 on August 1 of this year. Specifically, The new YRP10 premium printer achieves high-speed, high-precision solder printing. Also, it highlights fully automated setup changeovers and supports dual-lane production.

Mainly, YRP10 achieves the highest level of printing accuracy in the industry. This was achieved thanks to the adoption of the new-generation YR series platform with excellent rigidity, a 3S head*² with new squeegee, and stencil vacuum mechanism, and the optimization of printing conditions, etc. In addition, automation of setup changeovers, such as automatic push-up pins and stencil replacement, greatly reduces labor and human error when changing out products. Moreover, users can select dual-lane specification, which enables completely independent operation for each lane. This way, it flexibly supports a wide variety of production types.

Yamaha Motor realized the ideal concept of a 1 STOP SMART SOLUTION by taking advantage of the company’s strengths as a full-line-up manufacturer of mounting equipment. These include surface mounters, printers, dispensers, and inspection equipment. Also, the company promotes the Intelligent Factory system, which comprehensively realizes higher efficiency in the mounting process through smooth and advanced inter-equipment cooperation without black boxes.

YRP10 will be exhibited at JISSO PROTEC 2023 (24th Mounting Process Technology Exhibition), a comprehensive exhibition of electronic component mounting technology to be held at the Tokyo Big Sight from May 31st to June 2nd.

^*1: A machine that applies cream-based solder made of fine soldering particles, viscous fluid flux, and a binder to printed circuit boards (PCBs) with a spatula-like tool called a “squeegee.” By heating in a reflow oven, the solder melts, and bonds the surface-mount electronic components to the PCB.

^*2: Swing Single Squeegee head. Yamaha Motor original printing head controls the attack angle, speed, and printing application force with one squeegee.

Market Background and Product Outline

Ultra-compact chip components and narrow-pitch electrode components are being increasingly used in the field of electronic component mounting processes. Here, the trend toward smaller sizes, higher density, higher functionality, and diversification is accelerating. Along with this, the difficulty of solder paste printing on PCBs has dramatically increased, making it the most important process in determining the quality of the mounting process.

At the same time, labor shortages have led to a rapid increase in demands to reduce the labor requirements of production sites. In the printing process, a large amount of labor is required on setup changeovers that require advanced skills.

In addition to high speed and high accuracy, YRP10 automates all setup changeovers bringing reductions in labor requirements and tact time, and also lessening the possibility of human error with a lower need for skilled operators. This all contributes to improved productivity and quality. As YRP10 can also support completely independent dual-lane operation, it can flexibly and efficiently respond to increasingly diverse products and production formats.

YRP10 Main Features

1. Advanced full automation of setup changeovers and long-term non-stop operation

◎ Push-up pin automatic replacement function (option)

An optional push-up pin automatic replacement function supports the board from below. In addition to preventing human error, YRP10 also offers installation of two pins at one time, further shortening the times required for setup changeovers. The new printer accommodates large boards of L420×W420mm as it can arrange a maximum of 200 pins. In addition to the 5mm pitch specification, YRP10 also supports 2.5mm pitch specification with a high degree of freedom in pin arrangement.

*The maximum compatible board size for the 2.5mm pitch specification is L420 x W250mm. Option: Up to L420×W420 mm available

◎ Stencil automatic replacement function (option)

By setting the next stencil to be used while the printing press is running, automatic replacement of the stencil is enabled after the current printing is finished without actually stopping the printing press. With this feature, the new YRP10 supports stencils of up to L600×W550mm and L550×W650mm, allowing various stencil frame sizes to be handled using a one touch mechanism without tools.

◎ Soldering automatic transfer function (option)

During stencil replacement, any solder remaining on used stencils is automatically cleaned off without waste. It is then promptly transferred onto the new stencil after exchange. By using this feature together with the automatic stencil replacement function, it is possible to greatly reduce time losses and human error in setup changeovers.

◎ Solder automatic supply: Print Stability Control (PSC) system (option)

In addition to 6 oz., by supporting 12 oz. solder syringes, solder is automatically supplied without the need for stopping the printer over extended periods. A replenishment warning before the syringe becomes empty is issued through the syringe low volume detection function. Stable high-quality printing is provided by keeping the solder rolling width constant.

2) Printing at high speed with high accuracy

While providing high-speed printing performance with a core cycle time of 6 seconds, YRP10 achieves a high printing accuracy of ±6σ:±16μm Cpk ≥ 2.0 (using a CeTaQ measuring machine under optimal conditions).

◎ Improve print quality with the adoption of a new squeegee 3S head with revised material and shape

Equipped with a servo motor, the attack angle and speed of the squeegee can be arbitrarily set and changed by a program. Also, with the Company’s unique 3S (Swing Single Squeegee) head, printing under optimal conditions is enabled according to the solder type being used. A new squeegee with a revised material and shape realizes further improvements in printing quality, including longer stencil frame life, improved rolling performance and filling capabilities, along with greater reductions in solder sticking issues. It is also possible to reduce the amount of solder to be discarded.

◎ Stencil vacuum mechanism that enables improvements in high-precision printing

By adsorbing and fixing the stencil portion of the stencil, along with a stencil vacuum mechanism that reduces the effects of stencil distortion and stencil elongation, more stable high-precision printing is achieved by keeping the PCB and stencil in close contact. In addition, greater reductions in setup times are provided as there is no need to input offsets during reciprocating printing.

3) Completely independent dual-lane production

It is possible to operate each lane and set up completely independently of each other with the dual-lane specification. In addition, production using large PCBs of L420xW330mm is possible using the dual lanes. Higher production efficiency is attainable as it is possible to increase the number of PCBs taken and the number of carriers transported.

4) Other key features

As the YR series platform, the industrial equipment OS supports the latest Windows 10 and adopts a stylish graphical interface that is easy to look at and use. This provides a total design that can be used safely for long time periods.