Lasertec has announced the release of VIANCA Series, a via depth measurement system. The new system measures the depth of small-diameter, high-aspect-ratio vias for 3D, 2.5D, and hybrid bonding packaging processes.

Today, the progress of artificial intelligence (AI) technology drives the need for better-performing graphic processing units (GPUs). Meanwhile, the integrated high-bandwidth memories (HBMs) are also expected to achieve higher performance and smaller geometries. Amid this trend, through silicon vias (TSVs) in HBMs need to adopt smaller diameters and higher aspect ratios. However, it poses a big challenge for device manufacturers.

The VIANCA Series uses Lasertec’s proprietary optics to measure the depth of small-diameter, high-aspect-ratio TSVs. Specifically, this is a task previously impossible with other existing optics. Also, it can measure copper height during the redistribution layer (RDL) process as well as other key metrics that need to be controlled during HBM production.

As a company dedicated to addressing customer needs, Lasertec will keep contributing to process quality enhancement and yield improvement for leading-edge semiconductor production.

Features of the Depth Measurement System

Mainly, the VIANCA Series integrates Lasertec’s proprietary optics enabling the measurement of the depth of small-diameter, high-aspect-ratio TSVs. The company designed the new tool to support next-generation TSV architectures.

Specifically, the new tool is suitable for depth measurement after via etching as well as copper recess level control for hybrid bonding. Also, it applies to height measurement after copper pillar revealing and during bump formation.