Trymax Semiconductor Equipment, a leading provider of plasma- and UV-based solutions for semiconductor manufacturing, announces the installation of its 500th process chamber in Asia.

This milestone reflects continued momentum across key regional markets, such as China, Taiwan, South Korea, Malaysia, and the Philippines. Moreover, this groundbreaking feat of Trymax signals strong progress toward the company’s goal of 1,000 global installations by the end of 2025.

“Reaching 500 installations in Asia is a significant milestone for Trymax,” said Peter Dijkstra, Chief Commercial Officer at Trymax Semiconductor Equipment. “It reflects our team’s dedication to delivering practical, high-performance solutions with the speed and reliability that our customers need in order to stay competitive.”

Responsiveness as a Competitive Edge

In an industry where uptime, productivity, and reliability are critical, Trymax has earned a reputation for being highly responsive – from the inquiry stage to post-installation support. The company’s nimble structure allows it to take action quickly and decisively, enabling customers to manufacture with confidence. Many partners have cited the ease of communication with Trymax, and the timely support received, as reasons for early and continued engagement.

Supporting Asia’s Semiconductor Surge

Asia continues to lead global semiconductor growth, driven by accelerated adoption in high-demand sectors. Customers across the region are pushing forward with innovation and scale, particularly in diverse fields.

In the automotive, the ongoing transition from internal combustion engine (ICE) vehicles to electric vehicles (EVs) is reshaping the industry. EVs require significantly more semiconductors – often up to 3,000 chips per vehicle – due to greater electrification, power management, and onboard computing systems. For that reason, the shift is fueling demand for reliable, high-throughput semiconductor processing solutions.

Similarly, there the rise of artificial intelligence (AI) and machine learning applications, that is from data centers to edge devices, is creating a surge in demand for advanced microprocessors and high-density memory. Backend processes play a critical role in ensuring the performance and yield of these complex chips, making equipment reliability and process control essential.

Meanwhile, in 5G and connectivity, Asia has witnessed rapid deployment of 5G networks. Combined with its mobile-first population and high-volume data consumption, these feats have been pushing the limits of semiconductor performance. This growth requires advanced packaging technologies, faster interconnects, and increased wafer-level precision—all of which depend on stable, repeatable backend processing steps.

Forward Plans, Strategic Vision

Trymax has designed its plasma and UV curing technologies to meet these demands. Thus, delivering proven results in ashing, descum, surface cleaning and activation, and isotropic etching. With a strong footprint across the region, the company continues to support customers at the forefront of innovation.

To support its continued growth in Asia and globally, Trymax is advancing several strategic initiatives. The company is exploring plans to establish local manufacturing in China, a move aimed at strengthening supply chain resilience and improving responsiveness to regional customer needs.

As part of its 2025–2030 roadmap, Trymax is also deepening its collaborations with leading semiconductor manufacturers. By taking on selective, non-core process steps—particularly those related to backend wafer processing—Trymax helps larger players free up internal resources and maintain operational focus where it matters most.

In parallel, Trymax is expanding its role in advanced packaging. As integrated circuit (IC) designs evolve toward increasingly complex multi-layered stacks—sometimes comprising up to 16 layers—ensuring pristine, activated surfaces between each layer is critical. Trymax’s plasma solutions are engineered to meet these exacting standards, enabling customers to maintain high yield and reliability in next-generation device architectures.

15 May 2025