SEMICON Taiwan 2025 opened Wednesday (Sept. 10, 2025), spotlighting the global AI chip boom, which will be the focus of the three-day event taking place at Taipei Nangang Exhibition Center.

SEMICON Taiwan has emerged as one of Asia’s most sought-after annual semiconductor event. In fact, this year’s edition gathers around 1,200 exhibiting companies spread over 4,100 booths and an expected attendance of over 100,000 industry professionals.

AI Drives Global Chip Ecosystem Growth

Soaring AI demand is fueling rapid semiconductor growth, with SEMI projecting sub-7nm capacity to reach a record 1.4 million wafers per month by 2028, a 69% jump from 2024. Leveraging robust ecosystems and resilient supply chains, the region continues to play a critical role in supporting global AI chip production. “The AI-driven growth wave is reshaping the industry,” said Terry Tsao, Global Chief Marketing Officer and President of Taiwan, SEMI. “As the industry shifts to cross-domain collaboration, leading system companies are forging closer partnerships across the semiconductor value chain.”

Meanwhile, according to SEMI’s latest Market Intelligence, AI is extending from the cloud to the edge and end devices, driving demand not only in data centers but also for local real-time computing. Capital expenditures by the top four cloud service providers are projected to grow from US$210 billion in 2024 to US$310 billion in 2025, fueling the demand for AI infrastructure. In 2025, AI and high-performance computing (HPC) related equipment investments are expected to account for 40% of global semiconductor equipment spending, and this share is anticipated to exceed 55% by 2030.

The global semiconductor equipment market is forecast to grow by 7.4% to US$125.5 billion in 2025, with a further increase of 10% to reach a new high in 2026. Taiwan’s investments are projected to reach US$28 billion in 2025, an increase of over 70% year-on-year, driven by strong investments in HPC and advanced packaging. In terms of AI/HPC and memory transformation, GAA, HBM, 3D stacking, and chiplet packaging are becoming the focus of investment. 

Catalyst for Next Wave of Innovation

The focal point of International Semiconductor Week, this year’s SEMICON Taiwan adopts the theme Leading with Collaboration. Innovating with the World. The event features 25+ forums and 13 key technology themes, highlighting collaboration as the catalyst for the next wave of innovation. Industry leaders will share insights on AI-driven semiconductor trends, market strategies, and reveal key industry data.

Organizers of SEMICON Taiwan 2025 held pre-opening press conference, expecting a fruitful three-day event that will lead industry to further innovation.

Tsao led the pre-opening press conference and was joined by Dr. Tien Wu, Chair of the SEMI International Board Executive Committee and CEO of ASE; Doris Hsu, SEMI International Board of Director and Chairperson and CEO of GlobalWafers; Professor Tzi-Dar Chiueh, Dean of the College of Advanced Technology at National Taiwan University (NTU) and CEO of the Taiwan Chip-based Industrial Innovation Program Office; and Clark Tseng, Senior Director of Market Intelligence at SEMI.

Also present during the pre-opening press conference were leaders from industry, government, and academia to share forward-looking perspectives on the semiconductor industry.

New Model of Global Industry Collaboration

Amid rising semiconductor investment, the industry is shifting from supply chains to ecosystem collaboration. “SEMI connects the entire value chain, from design and manufacturing to packaging and system applications, helping members seize emerging opportunities,” said Terry Tsao. “The theme of ‘Leading with Collaboration. Innovating with the World.’ captures this shift, as SEMICON has become the unique global platform uniting the full value chain, with SEMICON Taiwan bringing the top industry players from around the world together to advance technology.”

Building on this vision, SEMI has advanced key standards and alliances. After launching the Silicon Photonics Alliance (SiPhIA) in 2024 with TSMC, ASE, and over 100 companies, SEMICON Taiwan 2025 will introduce the SEMI 3DIC Advanced Manufacturing Alliance (3DICAMA). The event will also mark the launch of certification for SEMI E187, the world’s first semiconductor equipment cybersecurity standard initiated by Taiwan, reinforcing Taiwan’s role in shaping the global semiconductor ecosystem.

10 September 2025