GlobalFoundries (GF) has reached a multi-year manufacturing agreement with TSMC to establish a U.S.-based supply of silicon interposers, a key component in advanced semiconductor packaging used for artificial intelligence (AI) and high-performance computing (HPC) systems.

The move is expected to strengthen the domestic semiconductor ecosystem while addressing surging demand for advanced packaging technologies.

Under the initial five-year agreement, valued at US$2 billion, GF will manufacture silicon interposers for TSMC’s CoWoS advanced packaging platform and expand fabrication capacity at its Malta, New York facility. The companies said the arrangement creates a foundation for further capacity expansion as customer requirements increase.

The announcement highlights the growing importance of advanced packaging in the AI era. As chipmakers develop increasingly complex processors and accelerators, technologies such as silicon interposers have become essential for connecting multiple dies within a single package while maintaining performance, power efficiency and scalability.

Malta Expansion Positions for Future Growth

GF expects the Malta facility to become the first U.S.-based source of silicon interposers supporting advanced packaging technologies, including embedded deep trench capacitor components. The added manufacturing capacity is designed to improve scale, flexibility and long-term supply assurance for future AI and HPC product generations.

Volume production is expected to begin ramping during the first half of 2028, establishing another domestic manufacturing capability at a time when governments and industry stakeholders are pushing to reinforce semiconductor supply chain resilience.

Advanced Packaging Emerges as Strategic Priority

The agreement underscores how advanced packaging is becoming a strategic differentiator across the semiconductor value chain. While leading-edge chips often attract the spotlight, the ability to package those devices efficiently has become equally important as AI workloads continue to scale.

“Advanced packaging is becoming increasingly critical to delivering the performance, power efficiency and scale required for next-generation AI systems,” said Ed Kaste, senior vice president of CMOS Business at GF.

Kaste added that the initiative leverages GF’s domestic manufacturing footprint to create “a secure, scalable source of essential advanced-packaging elements” that can help customers accelerate innovation while strengthening supply chain security.

By combining TSMC’s advanced packaging ecosystem with GF’s U.S. manufacturing capacity, the partnership aims to expand access to critical semiconductor packaging infrastructure and support the next wave of AI-driven computing demand.

09 October 2026