U.S. President Joe Biden joined Intel’s groundbreaking ceremony in Ohio on two of the world’s most advanced chipmaking facilities. Other federal state and local officials also joined the breaking ground in Silicon Heartland in Licking County.

In addition, Intel also announced the first phase of funding for its Ohio Semiconductor Education and Research Program. Accordingly, the program is part of Intel’s commitment to develop a skilled talent pipeline for its two new leading-edge chip fabs.

Drives New Innovative Products

In the ceremony, Pat Gelsinger, Intel Chief Executive Officer said the event marked a pivotal moment in the journey to build a more “geographically balanced and resilient semiconductor supply chain.” In addition, Gelsinger said, “The establishment of the Silicon Heartland is testament to the power of government incentives to unlock private investment, create thousands of high-paying jobs, and benefit U.S. economic and national security. We would not be here today without the support of leaders in the administration, Congress, and the state of Ohio, who share a vision to help restore the United States to its rightful place as a leader in advanced chipmaking.”  

Earlier, Intel has announced plans for an initial investment of more than US$20 billion in the construction of two new leading-edge chip factories in Ohio. Most importantly, the investment will help boost production to meet the surging demand for advanced semiconductors. At the same time, it will also help power a new generation of innovative products from Intel and serving the needs of foundry customers as part of Intel’s IDM 2.0 strategy. 

Intel foresees the new plant to generate 7,000 construction jobs and 3,000 long-term positions in manufacturing and engineering. It will also provide capacity for Intel’s next-generation products. In addition, the company expects these new factories to support growing demand for the company’s new foundry business, Intel Foundry Services (IFS). 

Intel’s investment in Ohio builds on the company’s announcement in Arizona to build two new fabs and its expansion in New Mexico to add advanced packaging capabilities. When combined with Intel’s silicon R&D capabilities, this new site in Licking County, Ohio, will expand the company’s U.S. “lab-to-fab” pipeline.   

Innovates Chipmaking

Intel’s Ohio Semiconductor Education and Research Program will fund collaborative proposals led by the University of Cincinnati, Central State University and Columbus State Community College. Also included are Kent State University, Lorain County Community College, Ohio University and two from The Ohio State University. Altogether, these eight proposals involve more than 80 institutions of higher education across Ohio. 

The eight leading institutions will receive US$17.7 million in funding over three years as part of Intel’s US$50 million commitment to Ohio higher education institutions over the next decade. This collaborative program will enable higher education institutions to address semiconductor manufacturing workforce shortages and technical challenges. Furthermore, this will innovate and develop new capabilities with an emphasis on chipmaking. Intel expects this first iteration of the program to produce nearly 9,000 graduates for the industry and provide more than 2,300 scholarships over a three-year period, fostering a diverse homegrown talent pipeline. 

Meanwhile, the program is part of the Intel’s larger commitment to expand digital readiness to reach 30 million people in 30,000 institutions in 30 countries. This education and workforce program is one more step forward in Intel’s 2030 Goals. Moreover, the company’s dedication to using tech as a force for good, underscoring its aim to make technology fully inclusive and to expand digital readiness worldwide.