Advantest Unveils New Mask SEM for Ultra-Small Photomask Defects

Leading semiconductor test equipment supplier Advantest Corporation has unveiled the E5620 Defect Review Scanning Electron Microscope (DR-SEM). This is the company’s newest mask SEM product for reviewing and classifying ultra-small defects on photomasks and mask blanks.

With its high-accuracy, high-throughput defect review capability, the E5620 DR-SEM is expected to contribute to production quality improvements in next-generation photomasks. Moreover, it is poised to contribute to shorter mask manufacturing turnaround times.

E5620 Defect Review Scanning Electron Microscope

Future Ready for Next-Gen EUV

Like its predecessor, E5620 implements Advantest’s highly stable image capture technology to easily import defect location data from mask inspection systems and automatically image the locations. The system has a number of improvements specifically to target future mask requirements.

“In working with our customers to determine their requirements for the future EUV photomask inspection and analysis, we identified several essential advancements to integrate into our proven DR-SEM system,” said Toshimichi Iwai, senior VP of the Nanotechnology Business Group with Advantest. “With the E5620, our team of lithography experts has created a superior tool that can handle today’s photomasks and is truly future-ready for the coming EUV generation.”

E5620 Key Features

The new E5620 DR-SEM features high spatial resolution. It highlights highly stable, fully automatic image capture. Also, this model is compatible mask inspection systems. Additionally, this new model features elemental composition analysis and backscattered electron analysis on an optional basis.

The E5620 DR-SEM is available for purchase now. Advantest will share further details regarding its new E5620 DR-SEM during SEMICON Japan 2022, December 14-16, at Tokyo Big Sight. To learn more, please visit the company in booth 1549 during the show.