Siemens Digital Industries Software has announced that Chipletz, an innovative fabless substrate startup, has selected Siemens as its strategic electronic design automation (EDA) provider. Particularly, the partnership involves the development of its groundbreaking Smart Substrate™ products.

After an extensive technical evaluation of available solutions, Chipletz selected a suite of Siemens’ industry-leading EDA tools for the design and verification of its Smart Substrate technology. Hence, facilitating the heterogeneous integration of multiple ICs in a single package. Accordingly, complementing critical artificial intelligence workloads, immersive consumer experiences, and high-performance computing.

Revolutionizing IC In-Package

Bryan Black, chief executive officer of Chipletz, said, “The Chipletz vision is to revolutionize semiconductor in-package functionality through the development of advanced packaging technology that bridges the gap between the slowing of Moore’s Law and the rising demand for compute performance.” In addition, Black said, “Our Smart Substrate designs, now in development, are very demanding. Siemens has demonstrated that they have the ideal technology for our needs.”

To design and verify the heterogeneous integration of multiple ICs into a Smart Substrate based package, Chipletz selected Siemens’ Xpedition™ Substrate Integrator software, Xpedition™ Package Designer software, Hyperlynx™ software and Calibre® 3DSTACK software solutions.

AJ Incorvaia, senior vice president of Electronic Board Systems at Siemens Digital Industries Software, said the company takes pride for having been selected as Chipletz’s primary semiconductor packaging design and verification supplier. In addition, Incorvaia said, “The Chipletz Smart Substrate technology offers Chipletz customers a robust path to bring multiple ICs, even from different vendors, into a wide range of system-in-package configurations using Siemens’ design tools to deliver a high-performing and cost-effective end-product.”