Yamaichi Electronics Co., Ltd. has developed High Heat Resistant FPC as a new product of the YFLEX®, a flexible printed circuit (FPC). Suitable for products used in high-temperature environments such as in-vehicle equipment, semiconductor manufacturing, and inspection equipment. The company has already started accepting orders from its global customers since August.

Long-Term Reliability

In recent years, there has been an increasing need to adopt FPCs in areas that require high heat treatment, such as in-vehicle applications. Furthermore, to withstand even higher temperatures, it was necessary to improve the adhesion of the insulating layer that protects the circuit board. At the same time, prevent the insulating layer from peeling off.

The newly developed High Heat Resistant FPC achieves long-term reliability even in an environment of 150°C. Particularly, by increasing the heat resistance of the adhesive layer in the cover lay film that protects the surface of the FPC.

Features

The High Heat Resistant FPC has several features. The features are as follows:

1. Even after use in high-temperature process at 150°C for 3,000 hours, there is no problem with electrical properties.

　        *Evaluation item: High temperature exposure at 150℃×3,00

*Judgment criteria: Continuity resistance change rate within ±10% and insulation resistance of 500 MΩ or more

2. Configurations can be single-layer or double-layer, and the insulation substrate base can be selected from liquid crystal polymer (LCP) or polyimide (PI).

　  Type: All 3 types

• YFA series (LCP base material, single-layer)
• YFB series (LCP base material, double-layer)
• YFH series (PI base material, single-layer / double-layer)

3. Due to the reinforced GND design, it can be used not only for high heat-resistant FPC applications but also for noise-resistant FPC applications.