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ASIA ELECTRONICS INDUSTRYYOUR WINDOW TO SMART MANUFACTURING

TDK Offers New Ultrasonic Modules for Collision Avoidance

TDK Corporation presents the ultrasonic sensor module USSM1.0 PLUS-FS featuring a mechanically decoupled sensor element from the housing. This makes the module immune to external mechanical vibrations that can falsify the measurement result. Also, the IP65/67 protected sensor with the order number B59110W2111W032 has a nominal voltage of 12V. It is possible to mount the sensor in a front chassis via an M19 thread with a locking nut or via snap hooks.

USSM1.0 PLUS-FS ultrasonic module from TDK

Further, the integrated signal processor ASIC is actuated via a driver and an integrated piezoelectric disk. It can calculate the signal propagation time with a repetition rate of up to 50 samples/s. This allows measuring distances from 18 to 200cm; in pitch-and-catch mode with several modules, even measuring distances of 4cm are feasible. The field-of-view (FoV) of the USSM1.0 PLUS-FS is ±35°. In this case, customers can optimize the FoV to suit their needs. Thus, programming of individual measurement scenarios is possible. The sensor module is suitable for a wide range of brightness conditions, including full sunlight. Also, it measures very accurately regardless of the color and translucence of the target object.

Particularly, the ultrasonic modules suit distance measurement and obstacle detection under difficult environmental conditions in autonomous mobile robots (AMR) or autonomous guided vehicles (AGVs).