DuPont Fortifies Lineup in Advanced Circuit Materials

Interconnect Solutions (ICS), part of DuPont Electronics & Industrial, has highlighted its broad portfolio of advanced circuit materials and solutions at the Taiwan Printed Circuit Association (TPCA) Show. The annual event in Taiwan concluded its three-day run on Oct. 27.

Recently, advancements in Artificial Intelligence (AI), Machine Learning (ML), and 5G networks have been growing drastically. In fact, this has been due to the growing demand for high-speed and high-frequency devices to meet the rapid development of data generation.

The Printed Circuit Board (PCB) industry is facing significant challenges and trends in miniaturization and increased functionality of electronic devices. That is, with the adoption of more densely packed and highly integrated package substrates and printed circuit boards.

“At DuPont, we have built strong capabilities globally in the PCB industry and across the value chain,” said Yuanyuan Zhou, global business director, Metallization & Imaging, ICS. “Our team has been developing industry-leading advanced metallization chemistries that enable the fast-growing AI applications. Furthermore, with the latest integration of machine learning in our product design, we can accelerate our speed to market. At the same time, offer novel solutions that streamline the design process, increase manufacturing yield and enhance the overall efficiency for our customers.”

DuPont’s total solutions to enable low-loss and signal integrity

Wide Range Portfolio

DuPont’s total solution offerings for the substrate and PCB market enable design engineers to apply high-performing materials and advanced chemistry to flex, rigid-flex, rigid PCB, and IC substrate configurations. Thus, with innovative solutions for IC substrates, advanced Multi-layer Board (MLB) full process, and AI applications, DuPont has wide range of lineup to satisfy the market needs.

DuPont™ Copper Gleam™ PPR-III pulse acid plating copper 

As a new generation pulse electroplating for advanced MLB and AI server station applications, it has excellent throwing power on through-hole. Particularly, to fulfill future fine line trend and reliability requirements.

DuPont™ Circuposit™ SAP8000 electroless copper 

A new generation SAP metallization technology, an ionic base catalyst electroless copper process, it can suit advanced package substrates. For example, high-end CPU or GPU and AI chip applications.

DuPont™ Microfill™ SFP-II-M acid plating copper 

A novel pattern plating solution for advanced package substrates and AI chip application, is designed for good pattern distribution on big unit sizes for high-performance computing applications.

DuPont™ Riston® DI1500 & DI1600M dry film photoresist 

An advanced fine line direct imaging photoresist solution for IC substrate application, with excellent fine line adhesion and resolution as well as high-yield performance.

Enables Low-Loss, Signal Integrity

In addition, with the rapid development of 5G, the Internet of Things, and autonomous driving technologies, the PCB industry is facing a huge challenge in reducing insertion loss and ensuring signal integrity for interconnect applications. DuPont’s total solutions enable low-loss and signal integrity are designed to meet the needs for higher frequency and higher speed signal-transmission applications. 

DuPont™ Pyralux® TFH/TFHS/GFL flexible copper-clad laminate 

An industry-leading signal integrity solution for consumer electronics. DuPont’s design capabilities enable a total solution for superior insertion loss over non-in-kind. At the same time, retaining the benefits of processibility and bending performance by modified Polyimide (mPI).

DuPont™ Pyralux® AP flexible copper-clad laminate 

An ideal Flexible Printed Circuit (FPC) laminate solution for high-reliability applications such as aerospace, defense, automotive, telecom, industrial, and medical use. Moreover, its reliability has been proven with a track record spanning around 30 years.

DuPont™ Interra® HK04J embedded capacitance laminate 

A thin buried capacitance laminate designed to function as a power and ground plane in high-speed signal transmission PCB. Particularly, to improve power integrity for communications applications. It meets generative AI high-speed computing PCB power integrity and device minimization requirements.

Laird Performance Materialsnow part of DuPont, designs and manufactures high-performance materials to mitigate electromagnetic interference and suppress broadband common mode noise. Offerings include Laird™ Tflex™/Tputty™ thermal interface material designed to minimize electromagnetic interference and Laird™ Steward™ CM5441/CM6050 inductive component designed to stop broadband common mode noise effectively and efficiently.