Axcelis Technologies, Inc. has announced the shipment of ion implanter solutions to leading power device chipmakers in Japan. Axcelis is a leading supplier of enabling ion implantation solutions for the semiconductor industry. Specifically, it has delivered Purion EXE™ SiC high energy implanter and Purion H200™ SiC medium energy implanter evaluation closure. Primarily, the systems target 150mm and 200mm production of silicon carbide power devices. Mainly, they support automotive, industrial, energy, and other power-intensive applications.

Greg Redinbo, Executive Vice President, Marketing and Applications of Axcelis, remarked, “The successful evaluation closure of the 200mm Purion H200 SiC system enables it to join an existing 200mm Purion EXE SiC in production at a leading power device customer in Japan.” Dr. Redinbo continued, “The shipment of an additional Purion EXE SiC to a new 150mm customer in Japan highlights growing customer requirements for even higher energy ion implant recipes on advanced SiC power devices. Mainly, the Purion Power Series can provide these requirements.”

Meanwhile, Axcelis, President and CEO, Russell Low, commented, “We look forward to supporting our growing installed base in Japan. Also, we remain focused on expanding our market share by providing customers with the most innovative implant technology and support solutions to ensure their success. (Particularly,) the Purion Power Series is the market leader due to its highly differentiated features and process control capabilities enabling power device applications. Axcelis is the only ion implant company that can deliver complete recipe coverage for all power device applications.”

-08 April 2024-