Ansys has announced a collaboration with TSMC on multiphysics software for TSMC’s Compact Universal Photonic Engines (COUPE). Specifically, COUPE is a cutting-edge Silicon Photonics (SiPh) integration system and Co-Packaged Optics platform. This mitigates coupling loss while significantly accelerating chip-to-chip and machine-to-machine communication. 

TSMC COUPE go along with Ansys multiphysics solutions and comes integrated with Synopsys’ 3DIC Compiler unified exploration-to-signoff platform. Essentially, they enable the next generation of silicon photonics and co-packaged optics designs for AI, data center, cloud, and HPC communications applications.

Moreover, the work spans multiple areas. They include fiber-to-chip coupling, integrated electronic-photonic chip design, and power integrity verification. Add to these are high-frequency electromagnetic analysis and critical thermal management.

Address Design Challenges

TSMC COUPE integrates multiple electrical ICs with a photonic IC and fiber optic connections into a single package. Moreover, these include Ansys Zemax^TM for optical input/output simulation and Ansys Lumerical™ for photonic simulation. It also has Ansys RedHawk-SC™ and Ansys Totem™ for multi-die power integrity signoff. In addition, the Ansys RaptorX™ to model high-frequency electromagnetic analysis between dies and Ansys RedHawk-SC Electrothermal™ for vital thermal management of the multi-die heterogeneous system also play role.

Furthermore, Lumerical allows custom Verilog-A models for electronic photonic circuit simulations. They work seamlessly with the TSMC Modeling Interface (TMI) and come co-designed with TSMC’s PDK.

“By providing a good silicon photonics integration system we can address both critical issues of energy efficiency and computing performance to support the explosive growth in data transmission that comes with the AI boom,” said Dan Kochpatcharin, head of the design infrastructure management division at TSMC.

Moreover, Kochpatcharin said, “We have aligned closely with our Open Innovation Platform® (OIP) partners like Ansys to provide our customers with a solution to the design challenges in this breakthrough technology, enabling their designs to achieve a new level of performance and energy efficiency.”

Meanwhile, John Lee, vice president and general manager of the semiconductor, electronics, and optics business unit at Ansys underscores the need for best solutions.

“Ansys’ multiphysics platform for TSMC’s COUPE technology underscores our focus on delivering the most comprehensive multiphysics portfolio with the best solution for every need,” said Lee. Moreover, Lee said, “Ansys is a leader in delivering a deep and broad portfolio of integrated multiphysics simulation solutions and platforms. Together, TSMC and Ansys are enabling the next wave of technological innovation.”

–25 April 2024-