Dai Nippon Printing Co., Ltd. (DNP) will open its first overseas Research and Development (R&D) Center in the Netherlands in September 2025. The new R&D Center will be located at the High Tech Campus Eindhoven (HTCE) in the southern part of the country, and aims to promote global R&D, while also accelerating innovation.

HTCE is one of the leading innovation hubs in Europe, where approximately 300 companies and research institutes, and more than 12,500 researchers, engineers and entrepreneurs come together to develop innovative technologies and products. 

In our first project at HTCE, we will promote R&D into Co-Packaged Optics¹ which is attracting attention as next-generation semiconductor technology.

On 3 July 2025, DNP signed an agreement with the Netherlands Organization for Applied Scientific Research (TNO) on joint R&D into Co-Packaged Optics. These activities will be promoted in conjunction with the Photonic Integration Technology Centre (PITC), a research organization located on the campus that connects basic research to the mass production of photonic chips (optical IC chips).

Background

DNP has adopted our current medium-term management plan for FY 2023-2025, promotes R&D themes such as, “Creating new businesses and advancing our strengths”, along with the “Global expansion of our strengths”. 

DNP has been exploring the possibility of establishing an overseas R&D base, including such activities as R&D for cutting-edge technologies and creating new businesses. In this latest development, we have decided to open our first overseas R&D base at HTCE, and as our initial project will engage in Co-Packaged Optics related R&D.

R&D Contents and Goals

• In recent years, the amount of information distributed has increased significantly due to the rapid spread of generative AI and the progress of digital transformation (DX). As a result, the increase in power consumption of data centers providing cloud services has become a major social issue. As it is expected that electrical-based high-speed transmission will not be able to keep up with the expansion of information distribution, there is a demand for the development of technology that transmits all information using light instead of electricity. In response to this need, Co-Packaged Optics technology, which integrates optical communication technology with electronic technology to achieve high information processing performance, low power consumption, and energy savings, is expected to be deployed in next-generation semiconductors.
• DNP has designated semiconductor-related products and services as a focus business area in the current medium-term management plan and is promoting the development of high-value-added products. As part of these efforts, we are promoting the development of package components for Co-Packaged Opticsthat integrate optical circuits with electrical circuits. In order to accelerate these efforts, we will conduct three years of joint research with PITC, and other HTCE-based organizations, aiming to acquire cutting-edge technologies, such as precision patterning technology for optical materials related to Co-Packaged Optics, as well as develop new partner companies.
• At HTCE DNP will promote open innovation bringing together a diverse range of companies, human resources and technologies. In doing so, we will not only promote Co-Packaged Optics, but also create new businesses that leverage our strengths. 

Looking Ahead

Through our new R&D base in the Netherlands, DNP will gain access to technologies and Co-Packaged Optics related R&D networks, further accelerating the development of package components for Co-Packaged Optics.

DNP will also further promote global R&D, aiming to establish new overseas R&D bases in locations other than the Netherlands, while keeping an eye on social issues, the global situation, and megatrends. In order to create new businesses that utilize our proprietary strengths, we will also promote the diversity and globalization of R&D professionals.

Notes

1 Co-Packaged Optics:  A technology that combines optical and electrical transmission technologies to significantly improve conventional technologies in fields such as information processing and data communication.

* Company and product names listed in this release are the trademarks or registered trademarks of the respective companies.

* The content of this release is current as of the date of announcement. It they may be changed without notice.

11 July 2025