Mitsubishi Electric Corporation said it will develop a prototype to demonstrate junction-temperature estimation technology for power modules. Accordingly, this is part of the European Union’s Horizon Europe project, which aims to enhance advanced power modules and improve cost efficiency in renewable-energy power generation.

Furthermore, the company’s European subsidiary, Mitsubishi Electric R&D Centre Europe B.V., is participating in the project called Flagship Advanced Solutions for Condition and Health Monitoring in Power Electronics (FLAGCHIP)*.

New Prototype in 2026

With an increasing focus on carbon neutrality, there’s a growing need to enhance the reliability and maintenance of electronic devices used in power conversion. Innovations are being developed to strengthen power module reliability and improve data acquisition and analysis methods for timely maintenance.

Thus, the FLAGCHIP project involves 11 companies and academic institutions from nine European countries working on these advancements. Moreover, demonstrations of wind-power and solar-power systems using these technologies will take place at test facilities in Norway and France.

Mitsubishi Electric will demonstrate a technology to estimate the junction temperature of SiC-MOSFET semiconductor chips in power modules. This will provide essential data for accurate module degradation estimation.

Starting in October 2026, the demonstration will use the new prototype at a test facility in France, converting direct current (DC) voltage for a wind-power generation system.

12 February 2025