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ASIA ELECTRONICS INDUSTRYYOUR WINDOW TO SMART MANUFACTURING

Philippines' IMI Gains Ground in Data Center, Automotive Markets

Philippine-headquartered electronics manufacturing services (EMS) company Integrated Micro-Electronics, Inc. (IMI) is strengthening its presence in two rapidly evolving electronics markets, securing new business in data center power semiconductor packaging while expanding its automotive camera module programs, moves that helped drive double-digit earnings growth during the first nine months of 2026.

The electronics manufacturing company reported core EBITDA of US$56.5 million for the first nine months of 2026, up 12.0% from US$50.4 million a year earlier. Third-quarter core EBITDA rose 9.8% year over year to US$19.5 million. Core revenue increased 3.6% to US$703.2 million, while gross margin improved to 10.4% from 9.0% in the prior-year period. Core net income climbed 52% to US$24.1 million.

Data Center Infrastructure Opens New Packaging Opportunities

Among the most significant developments during the period was IMI’s expansion into advanced power semiconductor module packaging serving data center infrastructure.

The company said it secured new business wins in power module packaging applications designed to support increasingly demanding requirements for power density, thermal performance and long-term reliability. The awards build on investments in advanced assembly, packaging and testing capabilities and expand IMI’s participation in a market benefiting from growing demand for computing and power-conversion capacity.

Louie Hughes, President and Chief Executive Officer, Integrated Micro‑Electronics, Inc. (Image Credit: IMI)

The move places IMI in a segment where semiconductor packaging and power electronics are becoming increasingly important components of next-generation computing infrastructure.

Automotive Camera Programs Gain Momentum

At the same time, IMI reported continued growth in its automotive camera module business as vehicle manufacturers deploy more sophisticated driver-monitoring systems and camera-based safety applications.

The company said its expertise in chip-on-board assembly and aluminum wedge-bonding technology enables the production of compact, high-reliability camera modules designed for automotive applications. These manufacturing capabilities support the increasing electronic content being incorporated into modern vehicle platforms.

“The progress we are delivering is the result of two years of decisive action to make IMI a stronger, more focused and more competitive company,” said Louie Hughes, President and Chief Executive Officer of IMI. “Strong EBITDA growth in both the third quarter and the first nine months demonstrates that our operational improvements are translating into sustainable earnings performance.”

He added: “New wins in data center power modules and our expanding automotive camera business show how IMI’s engineering depth and specialized manufacturing technologies create opportunities in attractive, high-reliability markets.”

Focus on Disciplined Growth

Alongside its operational performance, IMI continued to strengthen its balance sheet. Total debt declined to US$188.3 million as of September 30, 2026, from US$196.0 million at the end of 2025, while its debt-to-equity ratio improved to 0.69x.

Despite uneven demand conditions across some industrial markets, IMI said it remains focused on customer launches, scaling new programs and leveraging its global manufacturing network to support profitable growth.

06 November 2026