High-precision 3D sensing technology solutions provider CyberOptics Corporation has introduced the new Dual-Mode Multi-Reflection Suppression (MRS) sensor for the SE3000 solder paste inspection (SPI) system. The company featured this solution at the recent IPC APEX EXPO in California, United States.
The new Dual-Mode MRS sensor for the SE3000 SPI system provides maximum flexibility for dedicated solder paste inspection applications. In other words, one mode goes for high-speed inspection and another mode for high resolution inspection.
In addition, the new sensor is an extension of the proprietary MRS sensor portfolio that provides competitive performance in semiconductor and SMT markets. The SE3000 is ideal for measuring height, area, volume, registration, and bridging. Moreover, it also suits detecting insufficient paste, excess height, smear, offset, and more.
“We designed the Dual-Mode MRS sensor specifically for our SE3000 system to provide both superior performance and versatility for SPI,” said Dr. Subodh Kulkarni, President and CEO, CyberOptics. “We’re providing yet another solution that can significantly improve our customers’ yields, processes and productivity.”
At APEX, the company also featured the SQ3000+ Multi-Function system for inspection and metrology. Accordingly, this serves as extension of the SQ3000 platform deemed best-in-class. It not only conducts AOI and SPI, but uniquely delivers in-line, full coordinate measurement (CMM) data in seconds. The all-in-one system offers a combination of unmatched high accuracy and high speed, with an even higher resolution MRS sensor that inhibits reflection-based distortions caused by shiny components and surfaces.
The SQ3000+ is suitable for high-end applications, including advanced packaging, mini-LED.
Furthermore, it also fits advanced SMT for medical, military, aerospace, and advanced electronics, 008004/0201 SPI, socket metrology, and other challenging CMM applications.