Axcelis Technologies, Inc. a supplier of ion implantation solutions for front-end chip-making processes, said today that it has supplied its ion implanter equipment – Purion XE high energy and Purion M medium current Power Series implanters for a Japanese power device chipmaker.
The ion implanter series will be used in high volume production of 300mm thin silicon wafer that is based MOSFET and IGBT devices for automotive and other power management applications.
Executive vice president of product development, Bill Bintz, said, “The unique capabilities of the Purion Power Series, combined with the implant-intensive nature of the power device segment, uniquely positions Axcelis to benefit from growth in this market. These tools incorporate features and process control capabilities, including the platform’s thin wafer handling capability, that are enabling for the power device market. We look forward to expanding the Purion platform footprint in Japan and supporting our customers’ goals to increase their manufacturing capacity.”
Headquartered in Beverly, Mass., U.S, Axcelis has been providing innovative, high-productivity solutions for the semiconductor industry for over 40 years.
Axcelis is dedicated to developing enabling process applications through the design, manufacture and complete life cycle support of ion implantation systems, one of the the most critical and enabling steps in the IC manufacturing process.
Using ultra-high current power, ion implanter machine is to implant ionized chemical gases like boron and phosphor on silicon wafer to create n-type and p-type transistors.