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DRAM Memory Chip
SK hynix
SK hynix Starts Mass Production of First 24GB LPDDR5X DRAM
2023-08-11
ACTIS
EUVs
Lasertec Corporation
Pellicles
Defying down cycle, Lasertec capitalizes on rapid proliferation of EUV equipment
2023-02-17
235 layer-high NAND DRAM chips
3D DRAMs
EUV
Nanosheets
SEMI Korea
SEMICON Korea 2023
Techinsights
Semiconductor equipment vendors stay mixed on market demand
2023-02-17
Edwards Korea
Edwards Vacuum
Invest Korea Week 2022
Korea Attracts Foreign Hi-Tech Companies with Huge Market Opportunities
2022-11-06
1.4nm process technology
5G
6G
AI
HPC
Samsung Electronics
Samsung Foundry
Samsung Electronics Unveils Plans for 1.4nm Process Technology
2022-10-05
EV Group
Nanoimprint Lithography
Photomasks
photonics
Toppan
EV Group, Toppan Photomask Offer Nanoimprint Lithography for Photonics Manufacturing
2022-10-04
Inuitive
robotics
Vision-on-a-Chip
Latest Edge-AI Vision-on-Chip Gears up for High-Level Robot Autonomy
2022-09-29
Chip Packaging Technology
FCBGA
FCCSP
KPCA 2022
Samsung Electro-Mechanics
SoS
Samsung Electro-Mechanics Unveils Advanced Chip Package Technology
2022-09-27
Center for Engineering
DRAM
Lam Research
NAND
Semiconfuctor manufacturing
Lam Research Opens New State-of-the-Art Center for Engineering in Bengaluru
2022-09-19
3D chip stacking
EV Group
NanoCleave Laser Release Technology
EV Group Revolutionizes 3D Integration with NanoCleave Layer Release Technology
2022-09-15
Fabrication plant
Memory IC
SK hynix
SK hynix to Build M15X Fab in Korea, Preps up for Growth
2022-09-07
Canon
Lithography Plus
Lithography systems
semiconductor manufacturing
New Canon Platform Improves Efficiency of Lithography Systems
2022-09-06
Chip manufacturing
EV Group
Heterogenous chip integration
ITRI
EV Group Expands Collaboration with ITRI on Heterogenous Integration
2022-09-02
Rich Templeton
Sherman
Texas
Texas Instruments
TI Sets Out to Build 4 New Fabs in Home Turf
2022-05-19
AMDDm
Kria K26
Kria KR260 Robotics Starter Kit
NVIDIA
SOMs
AMD Eyes Robotics Market with New Kria Development Platform
2022-05-19
Arm
Corstone
Cortex-A
Cortex-A32
Cortex-M
Cortex-M85
Ethos-U55
Kochab
NPUs
ARM Unveils Two Subsystem Solutions for IoT Edge Device Markets
2022-05-12
Intel
Intel to Acquire Granulate Cloud Solutions
2022-03-31
Axcelis Supplies Ion Implantation System for Japanese Chip Maker
2022-03-31
3D chip packaging technology l d
3D Chiplet
heterogeneous chip design
UCIe
Industry Leaders to Set Chiplet Interconnection Standards for Heterogeneous Computing
2022-03-04
ALD
Chemical Vapor Deposition
CVD
D500
D700
Etching Equipment
Horiba STEC
Mass Flow Control
MFC
Growing Chip Complexity Proves Big Boost for Horiba STEC
2022-02-16
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