AEI

ASIA ELECTRONICS INDUSTRYYOUR WINDOW TO SMART MANUFACTURING

Nordson Paves Way for High Tech Tools in IC Packaging

Nordson Electronics Solutions will feature the latest technologies in fluid dispensing for semiconductor advanced packaging at the SEMICON Taiwan 2024.  

Specifically, Nordson Electronics will display its ASYMTEK Forte® fluid dispensing system at SEMICON Taiwan 2024. The annual event will take place from Sept. 4 to 6 in Taipei, Taiwan. Accordingly, it suits high productivity and accuracy for many semiconductor packaging and microelectronics manufacturing applications. The Forte system is ideal to tackle high-volume underfill, dispense gap fill, and sealing lines for fan-out/fan-in, strips, and module assembly.

Meanwhile, other featured technologies include developments for high-throughput panel-level packaging (PLP) and wafer-level packaging (WLP). Moreover, Nordson will also tackle the challenges of warpage during fluid dispensing operations.

Presentations will be available to show different configurations for WLP and PLP on the ASYMTEK Vantage® fluid dispensing system. Moreover, Nordson will also discuss ow these systems can successfully ensure precise dispense results with high throughput.

Technologies from Nordson Electronics Solutions are being developed to address challenges during the fluid dispensing process for semiconductor applications. Especially for wafer-level and panel-level packaging, these technologies ensure high-throughput, precise dispense results within the same footprint as current equipment.

Furthermore, experts will be ready to discuss how Nordson can support your manufacturing of reliable semiconductor products. SEMICON Taiwan will be held at TaiNEX, Taipei Taiwan, September 4-6, 2024.

Formidable Lineup

The next-generation and time-tested capabilities of ASYMTEK Forte system comes with an upgraded system to increase productivity by up to 50 percent over the top-selling Spectrum® ll, all in a space-saving footprint. Furthermore, it also has an improved UPH with swift acceleration, enhanced motion control, and IntelliJet® compatible Forte MAX dual-valve dispensing.

Forte offers real-time skew correction (patented) for better wet dispense accuracy and yield, as well as fast, repeatable setup with automated calibration.

In addition, Nordson Electronics Solutions is also exhibiting at Semicon China the ASYMTEK Vantage® fluid dispensing system. Thus far, this is the company’s  most advanced dispensing platform designed for high-end semiconductor packaging and assembly. Fast and accurate, the Vantage, when configured with dual IntelliJet valves, can jet into gaps less than 200 um, and up to 90,000 dots per hour.

Nordson Electronics Solutions makes reliable electronics an everyday reality. Through its ASYMTEKMARCH, and SELECT brands, the company supplies the world’s semiconductor, printed circuit board, and precision assembly manufacturers with the innovative fluid dispensing and surface treatment solutions. For over 35 years, Nordson Electronics solutions delivered cutting-edge engineering and applications excellence to help customers succeed. 

28 August 2024