ASMPT took center stage at SEMICON Southeast Asia 2026 and demonstrated how tightly integrated semiconductor packaging, intelligent SMT assembly, and smart factory technologies accelerated the next wave of AI‑driven electronics manufacturing.

The Singapore-headquartered company showcased at MITEC Exhibition Centre in Kuala Lumpur, Malaysia its latest products and solutions under the theme “Empower the Intelligence Revolution.” The company highlighted how its end‑to‑end solutions enabled production‑ready implementation of next‑generation applications spanning artificial intelligence, smart mobility, and hyperconnected systems.

ASMPT also contributed expert perspectives to the Advanced Packaging & Heterogeneous Integration Summit held alongside the exhibition. On May 4, Lim Choon Khoon, Senior Vice President and Chief Counsel for Advanced Packaging at ASMPT SEMI, discussed how a holistic approach to bonding and integration accelerated the industrialization of advanced packaging for AI applications.

His presentation highlighted the critical importance of aligning materials readiness, process integration, and in‑line metrology to enable reliable, high‑volume adoption of advanced packaging technologies.

Unified Manufacturing Stack for AI‑Era Production

At SEMICON Southeast Asia 2026, ASMPT demonstrated how the convergence of semiconductor and electronics manufacturing technologies supported scalable, high‑precision production across the entire value chain.

Exhibits from ASMPT Semiconductor Solutions, ASMPT SMT Solutions, and its software subsidiary Critical Manufacturing illustrated a unified approach—bridging advanced packaging, precision assembly, and factory‑level information flow.

The integrated demonstrations emphasized how manufacturers could shorten innovation cycles while maintaining yield, quality, and traceability in complex AI‑focused production environments.

Advanced Packaging Solutions for Intelligence Revolution

ASMPT’s booth featured advanced packaging and assembly solutions designed for co‑packaged optical and photonic components, high‑performance computing, energy management systems, computing platforms, imaging and sensor technologies, and automotive lighting.

These technologies directly addressed pressing industry challenges, including ultra‑fine‑pitch interconnects, rising integration complexity, and the need for scalable, production‑ready manufacturing solutions across both semiconductor and electronics domains.

Bridging Dies and SMDs on an Intelligent SMT Line

ASMPT SMT Solutions showcased how advanced semiconductor packaging capabilities had converged with high‑performance SMT assembly. Central to the demonstration was the award‑winning SIPLACE CA2, which combined high‑speed die assembly directly from wafer with classic SMT placement on a single platform. The system delivered throughput of up to 54,000 dies and 76,000 SMDs per hour, with placement accuracy reaching ±10 µm @ 3σ.

The SIPLACE TX micron further extended precision assembly capabilities, achieving placement accuracy of ±10 µm at throughput rates of up to 93,000 components per hour, supporting demanding System‑in‑Package and advanced module applications. These solutions were complemented by ASMPT WORKS Software and Factory Solutions, which added intelligent automation, analytics, and real‑time production transparency.

From Assembly Lines to AI‑Driven Factories

Beyond individual machines and processes, ASMPT presented an MES‑powered industrial operations platform from Critical Manufacturing, illustrating how electronics and semiconductor producers could evolve from connected operations to fully intelligent, AI‑driven manufacturing environments.

The platform demonstrated how manufacturers could leverage data coherence, real‑time visibility, and AI readiness to optimize production performance, accelerate decision‑making, and future‑proof operations in an increasingly complex and intelligence‑driven market.

05 May 2026