Nordson Test & Inspection will highlight its sophisticated lineup in the forthcoming 2023 IPC APEX EXPO, scheduled to take place Jan. 24-26, 2023 at the San Diego Convention Center in California. Particularly, the company will highlight the CyberOptics SQ3000™+ Multi-Function system for automated optical inspection (AOI), solder paste inspection (SPI), and coordinate measurement machine (CMM), the M2 AOI system.

In addition, it will also feature the CyberOptics SE3000™ SPI system and Quadra 7 X-ray system in their booth.

Provides Maximum Flexibility

The CyberOptics SQ3000+ all-in-one solution for AOI, SPI and CMM offers a combination of unmatched high accuracy and high speed, with an even higher resolution Multi-Reflection Suppression® (MRS®) sensor that inhibits reflection-based distortions caused by shiny components and specular surfaces. The system suits high-end applications including advanced packaging, mini-LED, advanced SMT, 008004/0201 SPI, socket metrology and other challenging CMM applications.

The M2 AOI system offers high-speed inspection and exceptional defect coverage with advanced megapixel technology. With high resolution and telecentric optics, the M2 provides complete inspection for wire bonds, die placement, SMT components and substrates.

Also available at Nordson’s booth is the new Dual-Mode MRS sensor in the CyberOptics SE3000™ SPI system provides maximum flexibility for dedicated solder paste inspection applications, with one mode for high-speed inspection and another mode for high resolution inspection.

Furthermore, the new sensor is an extension of the proprietary MRS sensor portfolio that provides industry-leading performance in semiconductor and SMT markets. The SE3000 is ideal for measuring height, area, volume, registration, and bridging. In addition, in detecting insufficient paste, excess height, smear, offset and more.

Tool of Choice

The company will also showcase the Quadra 7 X-ray system. At the cutting edge of X-ray inspection performance, Quadra 7 shows features and defects as small as 0.1µm non-destructively, with the ultimate image quality and magnification.

Ideal for root cause failure, wire bond integrity checking, component cracking, MEMs inspection and wafer level components including TSV and wafer bumps. Quadra 7 is the X-ray inspection and failure analysis tool of choice in a wide range of industries, including electronics packaging and wafer level manufacturing, automotive, energy and aerospace electronics inspection, and medical device and LED fabrication.